DY-P403 Hemming Polyamide Hot Melt Adhesive Cementing Fixing Materials For Electronic Component
Polyamide Hot-melt Adhesive/Hemming Adhesive (DY-P403)
1.Appearance:
Yellowish round grain with schistose shape
2.Property:
DY-P403 is a general type of polyamide hot-melt adhesive, which is made from dimer acid and polyamine through condensation reaction at high temperature.
It can dissolve in general organic solvents, the hot-melting viscosity of the resin is greatly related to the temperature that it gets.
The polyamide hot-melt adhesive possesses the following advantages, such as lower viscosity, good fluidity, good flexibility, high adhesive strength, good media corrosion resistance, good solubility and fluxing property at low temperature, higher heat stability etc.
3.Application
This type of resin is applied in heat-shrinkable sleeve for electric cable, sealing material for electrical connection, cementing or fixing materials for electronic component, bonding material for package, textile, leather, wood, plastic, metal and ceramics etc.
4.Technologic Index
| Acid Value,(mg KOH/g ≤) | 5 |
| Amine Value,(mg KOH/g≤) | 3 |
| Viscosity,(mpa.s/200ºC) | 4000-6000 |
| Softening Point,(ºC) | 160±5 |
| Color,(Fe-Co ≤) | 8 |
| Tensile Strength, (≥ MPa) | 13 |
| Water absorption, (≤ %) | 0.4 |
| Shear Strength, (≥ MPa, AL/AL) | 10 |
| Stretch Rate, (≥ %) | 250 |
|
Peeling strength, (≥ N/25mm,PE/PE,60±2ºC) |
100 |
| Operating Temperature( ºC ) | 190-200 |
Double packing: paper-plastic composite bag lined with PE film.
Net weight: 25Kgs per bag.
Stored in cool, airy and dry place, the package has to be sealed before using up the resins.
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