Shenzhen Hengxunda Circuit Technology Co.,LTD
                                                                                                           
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China ENIG pcb for control multilayer pcb fabrications FR4 high TG150 IT180 material Ni=5um AU=0.05um for sale
China ENIG pcb for control multilayer pcb fabrications FR4 high TG150 IT180 material Ni=5um AU=0.05um for sale
China ENIG pcb for control multilayer pcb fabrications FR4 high TG150 IT180 material Ni=5um AU=0.05um for sale
China ENIG pcb for control multilayer pcb fabrications FR4 high TG150 IT180 material Ni=5um AU=0.05um for sale
China ENIG pcb for control multilayer pcb fabrications FR4 high TG150 IT180 material Ni=5um AU=0.05um for sale
China ENIG pcb for control multilayer pcb fabrications FR4 high TG150 IT180 material Ni=5um AU=0.05um for sale

ENIG pcb for control multilayer pcb fabrications FR4 high TG150 IT180 material Ni=5um AU=0.05um

Price Negotiable
Price: USD 0.1-5/pcs
MOQ: 1pcs
Delivery Time: 7-10 days
Brand: hengsheng
Product Description
Process Capability And Checking Parameters(Rigid Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hengxunda Circuit Technology Co.,LTD
Location Rm1104, No.17 Lane 6 Huangjinshan Community, Bantian Street, Longgang District, Shenzhen
Contact Person angelina

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