pcb assembly services SMT and DIP services low volume pcb assembly surface mount pcb electonics pcb components assembly

Price Negotiable

Price: USD 0.1-5/pcs

MOQ: 1pcs

Delivery Time: 7-10work days

Brand: hengsheng

Product Description

Process Capability And Checking Parameters(Hard Board)
NO	ITEM	Technical Capabilities
1	Layers	1-38L
2	Max.Board Size	1200*610mm
		48"*24"
3	Finished Board Thickness	0.2mm--10.0mm
		0.008"--0.4"
4	Finished Copper Thickness	17um-420um
		0.5OZ--12OZ
5	Min.Trace Width/Space	0.075mm/0.065mm
		0.003"/0.0026"
6	Min.Hole Size	0.15mm
		0.006"
7	Hole Dim. Tolerance(PTH)	±0.05mm
		±0.002"
8	Hole Dim.Tolerance(NPTH)	±0.05mm
		±0.002"
9	Drill Location Tolerance	±0.05mm
		±0.002"
10	V-Cut Degrees	20-90 ºC
		20DEG-90DEG
11	Min.V-Cut PCB Thickness	0.4mm
		0.016"
12	N/C Routing Tolerance	±0.1mm
		±0.004"
13	Min.Blind/Buried Via	0.15mm
		0.06"
14	Plug Hole Size	0.2mm--0.6mm
		0.008"--0.024"
15	Min.BGA PAD	0.2mm
		0.008"
16	Materials	FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB

17	Surface Finish	HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F

18	Warp & Twist	≤0.75%

19	Electrical Testing	50--300V

20	Solderability Testing	245±5ºC,3sec Wetting area least95%

21	Thermal Cycling Testing	288±5ºC,10sec,3cycles

22	Ionic Contamination Testing	Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm

23	Soldmask Adhesion Testing	260ºC+/-5, 10S,3times

Process Capability - Technical Parameters(FPC)
Content	Common	Special	Surface treatment	Thickness
Minimum line width	0.07mm	0.05mm	Electroplated nickel gold	Ni:3-9um;Au:0.03-0.1um
Minimum line spacing	0.07mm	0.05mm
Minimum Drilling aperture	Φ 0.15mm	Φ 0.1mm
Aperture Tolerance	±0.1mm	±0.05mm	Chemical immersion gold	Ni:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel)	610mm*1200mm(Exposure limit)	250mm*35mm(only develop test samples)
Maximum imposition size (double panel)	610mm*1200mm(Exposure limit)	250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid)	610*1650mm		Electroplated hard gold	Ni:2-9um;Au:0.1-0.3um
Finished board impedance tolerance	±10%		Electroplated pure tin	Sn:3-7um
Maximum production layer	12L
Thickness To Diameter Ratio	2:1(Minimum aperture 0.1mm)
	5:1(Minimum aperture 0.2mm)		Anti-oxidation
	8:1(Minimum aperture 0.3mm)
Monthly production capacity/m²	16000 m²

Material
Substrate Material	PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium	Copper foil(1/3oz,1/2oz,1oz,2oz)
	Constantan
	Silver Paste
	Copper Ink
Adhesive	Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film	PI(0.5mil,1mil,2mil)(Yellow, White, Black)
	PET(1mil,2mil)
	Solder mask (green, yellow, black...)
Glue	3M467,3M468,3M9077,TESA8853...
Reinforcement Type	PI,FR4,PET,Steel,Aluminum...