MPM/Speedline Solder paste printing&Solder paste spraying BTB125
MPM/Speedline Online equipment fully automatic
Equipment size:1638.4m9 X1593.1mmX1418.6mm
Equipment weight:1039KG
Power requirements:200~400VAC/60Hz,15A
Air source requirements:5KGf/cm2(0.5Mpa)
Parameter
Substrate size:609.6mmx508mm
Minimum substrate size:50.8mmx50.8mm
Substrate thickness size:0.2mm~5.0mm
Printing channel:4.5kg(101bs)
transfer canal:2.5kg~4.5kg
Substrate clamping:Base plate clamping fixed top clamping, workbench vacuum, EdgeLoc edge clamping system
Substrate support method:Magnetic thimble optional parts: H-towers, support block, special fixture, Quik Too1
Printing area:609.6mmx508mm
Printing demolding:0mm~6.35mm
printing speed:0.635mm/second~304.8mm/second
Printing pressure:0~22.7kg
Template frame size:737x737mm
Image Field of View (FOV):10.6mx8.0mn
Datum type:Standard shape reference point
Camera system:Camera System: Single Digital Camera - MPM Patented Up/Down Vision System

Alignment accuracy and repeatability of the entire system:± 12.5 microns
Alignment accuracy and repeatability of the entire system:± 12.5 microns
Equipment power requirements:200~240VAC/60Hz,15A
Compressed air requirements:100psi@4cfm