Specialized equipment for transparent glue inspection SMT Equipment AOI


Method for detecting underfill on devices
A:Chip thickness                                                                                             Excessive glue layer height:: 
B:Excessive glue layer height                                                                      
                                                                                                                    Min:Should not be lower than the bottom
                                                                                                                    Max:Should not exceed the upper surface of the chip
                                                                                                                    Recommended height is 2/3 of the chip height

Glue filling quantity.
The smaller wide-spacing of CSP the higher filling arc required                The large the wide-spacing of csp,the smaller filling arc required


Sample Detection information
1.UV 3D imaging technology fully displaying 3D infrmation of UV glue,analyzing the,analyzing the profile finding inflcting points based on the transformation rate,analysing neighboring information,locating the climbing glue position and controlling the specific the information of climbing glue 
2.Precision measurement of trasparent glue height