TF Card Connector 1.5H Old Version Push-Push Micro Memory Slot, SMT PCB Electronic Connector for Mobile Devices & Embedded Systems
Product Description
This 1.5H Old-Version TF Card Connector is engineered for compact electronic devices that require stable and high-precision Micro SD card connectivity. The push-push mechanism ensures smooth insertion and ejection, while the gold-plated contact terminals provide reliable signal transmission and long-term durability.
Its LCP high-temperature shell and reinforced tin-plated solder terminals ensure excellent PCB solderability and mechanical strength. With 5,000+ mating cycles and a compact 1.5H low-profile design, this connector is ideal for applications requiring high-density assembly and long service life.
| Connector Type | TF / Micro SD Card Connector (1.5H Old Version) |
| Mounting Style | SMT PCB Mount |
| Insertion/Extraction Method | Push-Push |
| Contact Material | Copper Alloy with Gold Plating (per drawing requirements) |
| Shell Material | LCP UL94V-0 (Black) |
| Insulator Material | High-temperature LCP |
| Terminal Plating | Tin ≥ 80µ” (solder area); Gold plating on contact area (thickness varies by part number) |
| Rated Voltage | 30V Max |
| Rated Current | 0.5A Max |
| Contact Resistance | ≤ 100mΩ |
| Insulation Resistance | ≥ 100MΩ @ 500V DC |
| Withstanding Voltage | 500V AC / 1 min |
| Durability | 5,000 cycles Min |
| Operating Temperature | -20°C to +80°C |
| Operating Humidity | ≤ 95% RH (non-condensing) |
| Applicable Card | TF / Micro SD Memory Card |
| Overall Dimensions | As per technical drawing (14.40mm width, 13.60mm depth, height 1.5H) |
Applications
Mobile phones and smart handheld devices
Navigation systems and vehicle electronics
Industrial controllers and IoT terminals
Consumer electronics (audio players, cameras, drones)
POS machines, data loggers, embedded modules
Any PCB design requiring TF / Micro SD storage expansion
Precautions
Ensure correct PCB pad layout based on the provided drawing to maintain stable mechanical positioning.
Avoid excessive insertion force to protect the push-push structure.
Recommended reflow soldering per standard SMT process; avoid multiple reflow cycles.
Do not expose the connector to corrosive environments to protect gold-plated terminals.
Ensure the board surface is clean before mounting to prevent poor solder joints.
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