Micro Fit 3.0 2x6 Pin Header Connector, 3.00mm Pitch Side Entry PCB Power Signal Interface for Automotive Control, Industrial Automation, Server Hardware

This product is a Micro Fit 3.0 2×6 pin side-entry header connector designed for dense power and signal routing on printed circuit boards. With a compact 3.00 mm pitch and dual-row layout, it offers a high contact count while maintaining a small footprint, ideal for modern compact control units and power modules.

The housing is molded from black glass-filled LCP with UL94-V0 flammability and halogen-free properties, ensuring dimensional stability and safety during wave or selective soldering. Copper-alloy terminals with nickel plus matte tin plating provide excellent solderability, low contact resistance and improved corrosion resistance in harsh environments.

Electrical characteristics include contact resistance not exceeding 20 mΩ, insulation resistance of at least 1,000 MΩ and a dielectric withstand capability of 1500 VAC for one minute, delivering dependable performance for both low-voltage power rails and mixed signal lines. The 2.1 mm protruding tails form strong solder joints and add mechanical strength, while the minimum 1.5 kgf pin retention after reflow helps the connector survive vibration and shock.

The series supports customization for pin counts, plating thickness, housing color and matching cable assemblies, making it suitable for OEM projects or as a cost-effective alternative to branded Micro-Fit-style headers.

⚙️ Applications

• PCB Signal & Data Transmission: Used for board-to-board or board-to-module connections, including low-voltage signals, data transmission, and control interfaces.
• Consumer Electronics: Common in smart home appliances, printers, cameras, displays, controllers, and handheld devices for internal signal routing.
• Industrial Automation & Control Systems: Applied in PLCs, industrial control boards, sensors, meters, robotics modules, and automation I/O interfaces.
• Servers & Data Center Equipment: Used for backplane interfaces, storage modules, communication boards, and signal expansion connectors.
• Automotive Electronics: Suitable for ECUs, BMS modules, sensor units, dashboards, infotainment systems, and on-board control interfaces.
• Communication & Networking Devices: Used in routers, switches, IoT gateways, RF modules, and network communication cards.
• IoT & Smart Device Modules: Applied in Bluetooth modules, WiFi modules, GPS/Beidou modules, sensor nodes, and embedded system expansion ports.
• Power Control & Monitoring Boards: For auxiliary power transmission, monitoring signals, and low-power control circuits.
• Custom OEM/ODM Electronic Designs: Ideal for designs requiring customizable pin count, pitch, height, plating option, and configuration.

⚠️ Notes

• Ensure Correct Pin Alignment: Check orientation and positioning before mating to avoid mis-insertion, bent pins, or PCB pad damage.
• Do Not Exceed Electrical Ratings: Follow the specified current and voltage limits to prevent overheating or contact failure.
• Proper Insertion and Extraction Force: Avoid excessive force during mating/unmating to prevent deformation, cracked solder joints, or pin damage.
• Keep Contact Surfaces Clean: Ensure terminals remain free from dust, oil, oxidation, or contaminants that reduce conductivity.
• Follow Recommended Soldering Conditions: Use appropriate soldering temperature profiles according to plastic materials such as LCP, PA6T, PA66, or PBT.
• Verify PCB Hole Tolerance: Incorrect hole size may cause inadequate solder filling or mechanical instability.
• Avoid Mechanical Stress After Assembly: Do not apply lateral pressure or bending forces, especially for SMT pin headers.
• Maintain Proper Storage Conditions: Store in a dry, dust-free environment to prevent terminal oxidation; use anti-static packaging if required.
• Confirm Compatibility with Female Header: Ensure matching pitch, pin count, height, and contact design to avoid mating failure.
• Choose Correct Plating Specification: Select proper plating (gold, tin, nickel) based on your application’s durability, corrosion resistance, and signal reliability needs.