High temperature resistance 3.3 borosilicate glass plate
Heat resistant borosilicate glass plate for wafer substrates
glass plate for wafer substrates/ borosilicate plate for wafer substrates/ borosilicate glass plate for wafer substrates
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Densityρ: |
2.23±0.02g/cm3 |
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Hardness: |
>7 |
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Tensile strength: |
4.8×107Pa(N/M2) |
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Bulk modulus: |
93×103Mpa |
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Modulus of rigidity: |
3.1×1010Pa |
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Young's modulus: |
63KN/mm3 |
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Compressive strength: |
1200kg/cm2 |
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Poisson's ratio: |
0.18 |
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Thermal expansion coefficient: |
(0-300℃)(3.3±0.1)x10-6K-1 |
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Coefficient of thermal conductivity: |
1.2W×(m×k) -1 |
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Specific heat capacity: |
(20-100℃)00.82kJx(kgxk) |
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Optical performance: |
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1.Light transmittance: |
92% |
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2.The refractive index: |
Nd:1.47384 |
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3.The wavelength: |
435.8nm=1.481, 479.9nm=1.4772 , 546.1nm=1.4732 |
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Softening point: |
810±10 ℃ |
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The resistivity1gρ |
250℃8.0Ω×cm |
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Dielectric coefficientε |
4.7 |
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Dielectric strength |
5×107V/M |
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Dielectric loss factor |
tanσ(MC20℃)≤38×10-4 |
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Resistance to cold and hot shock |
280℃ |
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Continuous working temperature |
≤550℃ |
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Water resistance: |
ISO719 HGB Level 1 |
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Acid resistance |
ISO195 HGB Level 1 |
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Alkali resistance |
ISO695 HGB Level 2 |
Borosilicate glass is one of transparent colorless glass, through wavelength is between 300 nm to 2500 nm, transmissivity is more than 90%. Coefficient of thermal expansion is It can acid proof and alkali , the high temperature resistant is about 450°C. If course handling , the high temperature resistant can reach 550°C or so. Apply to lighting fixture , chemical industry , electron, high temperature equipment and so on.
Borosilicate glass has excellent transmission over the visible and NIR wavelengths working from 310nm to 2700nm. The surface quality is not as high as the BK7 versions.
Borosilicate glass has excellent chemical andthermal-shockresistanceand has a maximum working temperature of 500°C so are excellent for use in high powered light source applications or an excellent choice for cold and hot mirror substrates.
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