tempered sight glass borosilicate glass

Borosilicate glass or Pyrex glass High borosilicate glass namely high temperature resistant glass, heat resistant glass, temperature differential glass. The linear expansion coefficient is 3.3 + 0.1 × 10-6 K. it is a kind of glass based on sodium oxide (NA2O) , boron oxide (B2O2) and silicon dioxide oxide (SIO2) . The content of borosilicate in the glass is high, boron: 12.5 ~ 13.5% , silicon: 78 ~ 80% , so it is called high borosilicate glass. Properties of high borosilicate

Borosilicate glass or Pyrex glass High borosilicate glass namely high temperature resistant glass, heat resistant glass, temperature differential glass. The linear expansion coefficient is 3.3 + 0.1 × 10-6 K. it is a kind of glass based on sodium oxide (NA2O) , boron oxide (B2O2) and silicon dioxide oxide (SIO2) . The content of borosilicate in the glass is high, boron: 12.5 ~ 13.5% , silicon: 78 ~ 80% , so it is called high borosilicate glass. Properties of high borosilicate

Borosilicate glass or Pyrex glass High borosilicate glass namely high temperature resistant glass, heat resistant glass, temperature differential glass. The linear expansion coefficient is 3.3 + 0.1 × 10-6 K. it is a kind of glass based on sodium oxide (NA2O) , boron oxide (B2O2) and silicon dioxide oxide (SIO2) . The content of borosilicate in the glass is high, boron: 12.5 ~ 13.5% , silicon: 78 ~ 80% , so it is called high borosilicate glass. Properties of high borosilicate

Borosilicate glass or Pyrex glass High borosilicate glass namely high temperature resistant glass, heat resistant glass, temperature differential glass. The linear expansion coefficient is 3.3 + 0.1 × 10-6 K. it is a kind of glass based on sodium oxide (NA2O) , boron oxide (B2O2) and silicon dioxide oxide (SIO2) . The content of borosilicate in the glass is high, boron: 12.5 ~ 13.5% , silicon: 78 ~ 80% , so it is called high borosilicate glass. Properties of high borosilicate

Heat resistant borosilicate glass plate for wafer substrates glass plate for wafer substrates/ borosilicate plate for wafer substrates/ borosilicate glass plate for wafer substrates Densityρ: 2.23±0.02g/cm3 Hardness: >7 Tensile strength: 4.8×107Pa(N/M2) Bulk modulus: 93×103Mpa Modulus of rigidity: 3.1×1010Pa Young's modulus: 63KN/mm3 Compressive strength: 1200kg/cm2 Poisson's ratio: 0.18 Thermal expansion coefficient: (0-300℃)(3.3±0.1)x10-6K-1 Coefficient of thermal

Heat resistant borosilicate glass plate for Pressure vessel glass plate for wafer substrates/ borosilicate plate for wafer substrates/ borosilicate glass plate for wafer substrates Densityρ: 2.23±0.02g/cm3 Hardness: >7 Tensile strength: 4.8×107Pa(N/M2) Bulk modulus: 93×103Mpa Modulus of rigidity: 3.1×1010Pa Young's modulus: 63KN/mm3 Compressive strength: 1200kg/cm2 Poisson's ratio: 0.18 Thermal expansion coefficient: (0-300℃)(3.3±0.1)x10-6K-1 Coefficient of thermal conductivi

high quality tempered borosilicate sight glass window Size: OD 200mm x thickness 19mm type: Tempered glass thickness: 2-30mm fire resistance rating : perfect heat stability : good UV transmission :>80% Security : very good light transmittance :>90% Suface power :1-6MPA

tempered borosilicate sight glass disc glass plate for wafer substrates/ borosilicate plate for wafer substrates/ borosilicate glass plate for wafer substrates Densityρ: 2.23±0.02g/cm3 Hardness: >7 Tensile strength: 4.8×107Pa(N/M2) Bulk modulus: 93×103Mpa Modulus of rigidity: 3.1×1010Pa Young's modulus: 63KN/mm3 Compressive strength: 1200kg/cm2 Poisson's ratio: 0.18 Thermal expansion coefficient: (0-300℃)(3.3±0.1)x10-6K-1 Coefficient of thermal conductivity: 1.2W×(m×k) -1

3.3 borosilicate glass sight plate borosilicate glass plate for sight glass / borosilicate plate for wafer substrates Densityρ: 2.23±0.02g/cm3 Hardness: >7 Tensile strength: 4.8×107Pa(N/M2) Bulk modulus: 93×103Mpa Modulus of rigidity: 3.1×1010Pa Young's modulus: 63KN/mm3 Compressive strength: 1200kg/cm2 Poisson's ratio: 0.18 Thermal expansion coefficient: (0-300℃)(3.3±0.1)x10-6K-1 Coefficient of thermal conductivity: 1.2W×(m×k) -1 Specific heat capacity: (20-100℃)00.82kJx

Heat resistant borosilicate glass plate for Pressure vessel glass plate for wafer substrates/ borosilicate plate for wafer substrates/ borosilicate glass plate for wafer substrates Densityρ: 2.23±0.02g/cm3 Hardness: >7 Tensile strength: 4.8×107Pa(N/M2) Bulk modulus: 93×103Mpa Modulus of rigidity: 3.1×1010Pa Young's modulus: 63KN/mm3 Compressive strength: 1200kg/cm2 Poisson's ratio: 0.18 Thermal expansion coefficient: (0-300℃)(3.3±0.1)x10-6K-1 Coefficient of thermal conductivi

Level gauge glass Level gauge glass is a kind of glass made of heat-resistant glass, tempered, with high temperature resistance, tensile strength and chemical stability of glass, mainly used to observe the level of boiler or pressure vessel. Because of the high temperature and high pressure liquid corrosion performance is large, so the glass used in the boiler or pressure vessel level gauge must be selected with high strength, high temperature resistance, cold and hot impact

Heat resistant borosilicate glass plate for wafer substrates glass plate for wafer substrates/ borosilicate plate for wafer substrates/ borosilicate glass plate for wafer substrates Densityρ: 2.23±0.02g/cm3 Hardness: >7 Tensile strength: 4.8×107Pa(N/M2) Bulk modulus: 93×103Mpa Modulus of rigidity: 3.1×1010Pa Young's modulus: 63KN/mm3 Compressive strength: 1200kg/cm2 Poisson's ratio: 0.18 Thermal expansion coefficient: (0-300℃)(3.3±0.1)x10-6K-1 Coefficient of thermal

Arc shape quartz glassglass plate for wafer substrates/ borosilicate plate for wafer substrates/ borosilicate glass plate for wafer substratesDensityρ:2.23±0.02g/cm3Hardness:>7Tensile strength:4.8×107Pa(N/M2)Bulk modulus:93×103MpaModulus of rigidity:3.1×1010PaYoung's modulus:63KN/mm3Compressive strength:1200kg/cm2Poisson's ratio:0.18Thermal expansion coefficient:(0-300℃)(3.3±0.1)x10-6K-1Coefficient of thermal conductivity:1.2W×(m×k) -1Specific heat capacity:(20-100℃)00.82kJx

Heat resistant borosilicate glass plate for wafer substrates glass plate for wafer substrates/ borosilicate plate for wafer substrates/ borosilicate glass plate for wafer substrates Densityρ: 2.23±0.02g/cm3 Hardness: >7 Tensile strength: 4.8×107Pa(N/M2) Bulk modulus: 93×103Mpa Modulus of rigidity: 3.1×1010Pa Young's modulus: 63KN/mm3 Compressive strength: 1200kg/cm2 Poisson's ratio: 0.18 Thermal expansion coefficient: (0-300℃)(3.3±0.1)x10-6K-1 Coefficient of thermal