Shenzhen HiLink Technology Co.,Ltd.
                                                                                                           
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High Density Connections DAC SFP Plus Cable For Data Center Cabling Infrastructure

Price Negotiable
Price: Negotiable
MOQ: 1pcs
Delivery Time: 1-3 Days
Brand: HILINK
Product Description

High Density Connections DAC SFP Plus Cable For Data Center Cabling Infrastructure
 
Product Description
 
The SFP+ passive cable assemblies are high performance, cost effective I/O solutions for 10G Ethernet and 10G Fiber Channel applications. SFP+ copper modules allow hardware manufactures to achieve high port density, configurability and utilization at a very low cast and reduced power budget. The high speed cable assemblies meet and exceed Gigabit Ethernet and Fiber Channel industry standard requirements for performance and reliability.
 
 
Features

Cisco GenuineSFP-H10GB-CU5MVendor NameHilink
Connector TypeSFP+ to SFP+Max Data Rate10Gbps
Cable TypePassive Copper CableWire AWG24AWG
Cable Length5mJacket MaterialPVC
Temperature0 to 70°C (32 to 158°F)HTS-Harmonized Code8544700000

 
 
Applications
 
High capacity I/O in Storage Area Networks, Network Attached Storage, and Storage Servers
Switched fabric I/O such as ultra high bandwidth switches and routers
Data center cabling infrastructure
High density connections between networking equipment

Recommended Operating Conditions
 
 

ParameterSymbolMinTypicalMaxUnit
Storage Ambient Temperature -40 +85Centigrade
Operating Case TemperatureTc0 +70Centigrade

 
 
Systems
 

PerformanceMedia
10.5 Gpbs line speed, full duplex

Bit error rate: better than 10E-12

Hot-pluggable, industry-standard Small Form-Factor

Pluggable (SFP+) copper cable, available as 0.2m, 0.5m, 1m, 3m, 5m or 10m.

 
 
About order
 

Part No.Product Description
SFP+-10G-CU10G SFP+ Direct Attach Passive Copper Cables 0.2m,0.5m,1m,3m,5m or 10m Reach

 

 
Mechanical Specifications
 

 
 
 
 

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen HiLink Technology Co.,Ltd.
Location 11F DongMing Building, Minzhi Street, Longhua District, Shenzhen , China
Contact Person Wheat Mai

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