UEW PEW SEIW EIW 0.012mm Copper Wire 0.02 - 0.6mm Self Bonding Enamelled Copper Wire
UEW PEW SEIW EIW 0.012mm COPPER WIRE 0.02-0.6MM SELF BONDING ENAMELED COPPER WIRE
Enameled copper wire is a fundamental part of a winding in every electrical machine or apparatus. Compared to fibrous insulations, enamelled copper offers a favourable space saving factor together with a high level of breakdown voltage. The main application of Enamelled Copper Wire &is in winding of Motor and Transformers.
FEATURES
1. Can be bonded by solvent,electric current or hot air
2. higher coil operation temperature
3. Bonding by hot air or electric current,smooth surface, easy separation from metal molds and jigs
CERTIFICATES
ISO 9001-2000, ISO TS 16949, ISO 14001-2004,
UL Approved, RoHS Directive Met
APPLICATION
Switching transformers, information & telecommunications equipment, game machines, consumer goods, inverters and other similar devices.
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Bond Coat |
Polyvinyl butyral |
Alcohol soluble polyamide |
polyamide |
Thermo setting varnish |
Thermo setting varnish |
Thermo setting varnish |
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Diameters available |
0.02-0.6 |
0.02-0.6 |
0.02-0.6 |
0.06-0.6 |
0.06-0.6 |
0.06-0.6 |
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Bonding Method |
Solvent |
O |
O |
O |
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O |
O |
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Hot air |
O |
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O |
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Elec.current |
O |
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O |
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Heating temp |
150-170 |
180-200 |
120-170 |
180-220 |
180-220 |
180-220 |
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Base Coat Type |
UEW |
O |
O |
O |
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UEW-K |
O |
O |
O |
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PEW |
|
O |
O |
O |
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SEIW |
|
O |
O |
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O |
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EIW |
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O |
O |
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O |
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Thermal Class |
B/F |
B/F/H |
B/F/H |
F |
H/C |
H/C |
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Max. coil operation temperature for reference |
90 |
140 |
140 |
180 |
200 |
220 |
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Features |
Can be bonded by solvent,electric current or hot air |
Solvent bonding higher coil operation temperature |
Bonding by hot air or electric current, smooth surface, easy separation from metal molds and jigs |
Two steps are necessary-solvent molding and thermosetting, the bonding strength increases by heating at high temperature |
Two steps are necessary-solvent molding and thermosetting, the bonding strength increases by healing at high temperature |
Two steps are necessary-solvent molding and thermosetting, peeling off is easier than RS-EM. The bonding strength increases by healing at high temperature |
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