JIMA Copper
                                                                                                           
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18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates

Price Negotiable
Price: Negotiation
MOQ: 10kg
Delivery Time: 5-15 days
Brand: JIMA
Product Description

18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing/High-Speed Copper Clad Laminates

 

JIMA Copper is doing copper foil of Li-ion battery 4.5um to 14um more than 12 years. and production capacity 150000tons /years.

 

Features:

 

1,Special silane treatment with high peel strength

 

2,Nanoscale treatment of copper nodules

 

3,Excellent anti-oxidation and shelf life

 

4,Enhanced Bonding Strength

 

5,Smooth Surface Finish,High Electrical Conductivity

 

6,Improved Flexibility,Resistance to Corrosion

 

7,Diverse Thickness and Width Options

 

8,It has better etching performance. It can effectively shorten the production process, achieve higher speed and fast micro-

 

etching, and improve the qualification rate of printed circuit boards.

 

 

Application:

 

1,High Density Interconect(HDI)

 

2,High speed digital

 

3,Production of high-frequency and high-speed copper clad laminates

 

4,Communication electronic equipment (Base station / Server  routers, switches)

 

5,Computer hardware

 

6, PCB board manufacturing

 

7, Semiconductor industry

 

8, Electromagnetic shielding and heat conduction

 

9,Multilayer board;high-frequency board

 

 

 
Details Package: wooden box

FAQ:

 

Q1: delivery time ?
 

A: The general delivery time is 10~15 working days.


Q2: What's your minimum order quantity?
 

A: The MOQ is 10kg.
 
Q3. what is your standard width?
 
A:
300mm 500mm 600mm,we accept customization for the width. we can cut it into any size that you demand after pass discussing.
 

 18μm RTF Reverse Copper Foil Series standard sample digital:

 

 

Specifications standard sample(35 μm)


Mechanical Properties
Ra on matte side Rz
<2.5 μm
Tensile strength
>330 MPa
Elongation
>5%
peel strength(FR4)
≥1.5 N/mm(FR4)

 

18μm RTF Reverse Copper Foil Series Technical Data Sheet:

 

Project
Unit
Technical requiremente
Thickness
μm
18
35
70
Unit Area Weight
g/m2
145±5
275±5
585±5
Roughness 
M side Rz
μm
≤3.5
≤5.0
≤8.0
S side Rz
μm
≤3.0
≤3.0
≤3.0


Tensile Strength
25℃
MPa
≥320
≥320
≥320


Elongation
25℃
%
≥5
≥8
≥8


Peel Strength
N/mm
1.2
1.2
1.2
Antioxidant Capacity
-
200℃ 40min No oxidation

 

 

 

Remark: accept customization, Standard Width,100-1440(±1)mm,

 

 

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company JIMA Copper
Location No.60 Guoxia Road, Yangpu District, Shanghai,China.
Contact Person JIMA Annie

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