ED Electrodeposited Copper Foil For Mylar Tape None Pinholes 99.8% Purity
HTE electrodeposited ED electrolytic copper foil(High temperature elongation electrodeposited ED Copper foil)
Features:
1. the treated foil in gray or red
2. High peel strength
3. Good etch ability
4. Excellent adhesion to etching resist
5. Anti foil cracking by high elongation at elevated temperature
6. Eco-friendly products and processes
Application:
1. Polyimide board
2. Epoxy board
Typical properties of High temperature elongation copper foil(for epoxy &polyimide board)
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Classification
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Unit | Requirement | Test Method | |||||||||||
| Foil Designation | / | T | H | M | 1 | 2 | 3 | IPC-4562A | ||||||
| Nominal thickness | / | 12um | 1/2 OZ | 3/4 OZ |
1 OZ |
2 OZ |
3 OZ |
IPC-4562A | ||||||
| Area Weight | g/㎡ | 107±4 | 153±5 | 228±8 | 285±10 | 580±15 | 860±20 |
IPC-TM-650 2.2.12.2 |
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| Purity | ％ | ≥99.8 |
IPC-TM-650 2.3.15 |
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| Foil Profile | Shiny side (Ra) | սm | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 |
IPC-TM-650 2.3.17 |
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| Matte side(Rz) | um | ≤5 | ≤7 | ≤8 | ≤9 | ≤13 | ≤18 | |||||||
| Tensile Strength |
R.T.(23℃)
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Mpa | ≥150 | ≥220 | ≥235 | ≥280 | ≥280 | ≥280 |
IPC-TM-650 2.3.18 |
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| Elongation |
R.T.(23℃)
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％ | ≥4 | ≥4 | ≥4 | ≥5 | ≥5 | ≥5 |
IPC-TM-650 2.3.18 |
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| Subject | Ω.g/㎡ | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | ≤0.162 | ≤0.162 |
IPC-TM-650 2.5.14 |
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| Peel Strength(FR-4) | N/mm | ≥1.0 | ≥1.3 | ≥1.6 | ≥1.6 | ≥2.1 | ≥2.1 |
IPC-TM-650 2.4.8 |
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| Pinholes&porosity | Number | No |
IPC-TM-650 2.1.2 |
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| Anti-oxidization | R.T.(23℃) | day | 180 | / | ||||||||||
| H.T.(200℃) | Minutes | 60 | / | |||||||||||
3. Standard Width,1295(±1)mm,May according to the customer request tailor.
We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.
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