STD Standard Shielding Adhesive Copper Foil For Phenolic Resin Board
STD electrodeposited electrolytic ED copper foil (Standard electrodeposited electrolytic ED copper foil )
Features:
1.the treated foil in gray or red
1.High peel strength
3.Good etch ability
4.Excellent adhesion to etching resist
Application:
1. Phenolic resin board
2. Epoxy board
3. shielding
Typical properties of Standard copper foil for phenolic resin board and epoxy board.
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Classification
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Unit | Requirement | Test Method | |||||||||||
| Foil Designation | / | T | H | M | 1 | 2 | 3 | IPC-4562A | ||||||
| Nominal thickness | / | 12um | 1/2 OZ | 3/4 OZ |
1 OZ |
2 OZ |
3 OZ |
IPC-4562A | ||||||
| Area Weight | g/㎡ | 107±4 | 153±5 | 228±8 | 285±10 | 580±15 | 860±20 |
IPC-TM-650 2.2.12.2 |
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| Purity | ％ | ≥99.8 |
IPC-TM-650 2.3.15 |
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| Foil Profile | Shiny side (Ra) | սm | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 |
IPC-TM-650 2.3.17 |
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| Matte side(Rz) | um | ≤6 | ≤8 | ≤10 | ≤10 | ≤15 | ≤20 | |||||||
| Tensile Strength |
R.T.(23℃)
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Mpa | ≥150 | ≥220 | ≥235 | ≥280 | ≥280 | ≥280 |
IPC-TM-650 2.3.18 |
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| Elongation |
R.T.(23℃)
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％ | ≥2 | ≥3 | ≥3 | ≥4 | ≥4 | ≥4 |
IPC-TM-650 2.3.18 |
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| Subject | Ω.g/㎡ | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | ≤0.162 | ≤0.162 |
IPC-TM-650 2.5.14 |
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| Peel Strength(FR-4) | N/mm | ≥1.0 | ≥1.3 | ≥1.6 | ≥1.6 | ≥2.1 | ≥2.1 |
IPC-TM-650 2.4.8 |
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| Pinholes&porosity | Number | No |
IPC-TM-650 2.1.2 |
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| Anti-oxidization | R.T.(23℃) | day | 180 | / | ||||||||||
| H.T.(200℃) | Minutes | 60 | / | |||||||||||
1. Standard Width,1295(±1)mm,May according to the customer request tailor.
2. We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.
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