1OZ High Elongation ED Copper Foil , Good Etch Ability Rolled Copper Foil
Product Description
High elongation ED copper foil at high temperature electrolytic copper foil for MCCL (Metal Copper Clad Laminate )
Features:
1. The treated foil in gray or red
2. High peel strength
3. Good etch ability
4. Excellent adhesion to etching resist
5. Anti foil cracking by high elongation at elevated temperature
6. Eco-friendly products and processes
7. High temperature elongation
8. high peel strength
Application:
1. PCB board
3. Antennas pcb
4. Metal Copper Clad Laminate
5. MCCL
COA of High temperature elongation copper foil
| Thickness | um | 12 | 18 | 35 | 70 |
IPC-TM-650 2.3.12 |
|
| Area weight | g/m² | 107±10 | 153±15 | 305±30 | 610±61 |
IPC-TM-650 2.2.12 |
|
| Roughness | (RA) | μm | <0.43 | <0.43 | <0.43 | <0.43 |
IPC-TM-650 2.2.17 |
| (RZ) | μm | <7 | <8.0 | <10.0 | <14 | ||
|
Copper≥ |
% | Above99.8 |
IPC 4562 2.3.15 |
||||
| Tensile Strength | State normal | kg/mm2 | >21 | >21 | >28 | >28 |
IPC 4562 2.4.18 |
| State temper (180℃) | >15 | >15 | >15 | >15 | |||
| ElongationI | state normal | % | >3.0 | >4 | >5 | >5 |
IPC 4562 2.4.18 |
| state temper (180℃) | % | >2 | >2 | >3 | >3 | ||
| Peel strength | kg/cm | >1.1 | >1.3 | >1.7 | >1.9 |
IPC 4562 2.4.8
|
|
|
High temperature oxidation resistance(225℃, 10min) |
No color change | CCP Standard | |||||
| Solderability | Good | CCP Standard | |||||
| Splice | ≤2 | CCP Standard | |||||
Remark:
1.Standard Width is1295(±1)mm,Max width is 1380mm,May according to the customer request tailor.
Products shows:
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