JUNHE-2529 Diamond Wire Cutting Fluid is a new type of product, it is mainly used for cutting process of all kinds of hard brittle materials(monocrystalline silicon, polycrystalline silicon, germanium, gallium arsenide, quartz, indium gallium nitride, gems, non-metallic materials, etc.), the features of excellent lubrication,coo ling,corrosion resistance,rust resistance and hydrogen inhibition function. The silicon surface TTV after cutting is small without wire mark and can prolong the life of diamond wire.

Product Features:

1. Two different components,add the defoamer at any proportion according to different cutting machine.

2. Excellent lubrication, which can effectively prevent the silicon in the process of cutting brittle cracks or scratches, reduce the warp of silicon wafer surface roughness and surface, To minimize the total thickness deviation deviation of silicon wafers.

3. Less foam,easy to use.

4. Unique suspension property,avoid silicon powder deposition block machine pipeline.

Technical parameters:

Application method:

This product use concentration from 0.2% to 0.5%, according to the specific process appropriate adjustments.

Package,transportation and storage:

IBC Packaging

Storage in ventilation, cool, dry place

Notes:

1. Storage in the process of prevent oil mixed with water, otherwise may cause product deterioration.

2. If the liquid color getting darker durings storage or in the process of using,does not affect the use effect.

3. Do not eat,rinse it with clean water immediately if it gets into eyes accidentally. serious hospital for treatment.