94v0 UL Rohs FR4 Printed circuit board assembly
 
Platform: MTK6580 quad-core A7 1.3G
Operating system: Android 5.1
Memory: 1G + 8G / 2G + 16G
Network standard: 2GGSM: 850/900/1800 / 1900MHz four bands
3GWCDMA: 850/1900 / 2100MHz
Resolution: HD: 1280X720
Camera: Front 2MP, rear 8MP
Video: Decode: 1080p 30fps Encode: 1080p 30fps
Bluetooth: BT4.0
WiFi: 802.11b / g / n
FM: FM radio

Chip: using MTK6572 dual-core processor, 512M running memory, faster, more stable
Camera: built-in 800W pixel rear camera, 200W pixel front camera. Support face recognition, smiling face, more fun
Screen: 960 * 540 resolution 4.5-inch high-definition display
System: the most fashionable Andrews system, version 4.4.2, running more stable and smoother
Network: dual card dual standby, support mobile 2G network, Unicom 2G network, China Unicom 3G network, does not support telecommunications
Appearance: high-density engineering materials, wear-resistant, non-slip, high-end technology, domineering
Other: support picture in picture, WIFI, Bluetooth, FM, 3G Internet, games, music, e-books, massive software, unlimited downloads

What KAZ Circuit can do for you:

• PCB manufacturing (prototype, small to medium, mass production)
• Components Sourcing
• PCB Assembly/SMT/DIP

To get a full quotation of the PCB/PCBA, pls provide the information as below:

• Gerber File, with detail specification of the PCB
• BOM List (Better with excel fomart)
• Photoes of the PCBA (If you have done this PCBA before)

Manufacturer Capacity:
 

Products Application:

1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense

8, Automotive

9, Smart Home

10, Industrial Automation

11, Medical Devices

12, New Energy

And so on

Advantage Of PCB Assembly Service
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test