150W 24VDC Thermoelectric Cooler Peltier Cold Plate Conditioner For Lasers

System Assembly
Several methods for installing thermoelectric modules have been developed, including: mechanical clamping, epoxy bonding, and direct solder bonding. The individual requirements of the application will determine which method is most appropriate, however, mechanical clamping is by far the most common.

Thermoelectric modules are relatively strong in compression and weak in shear. Whichever method of installation is used, it is important to avoid excessive mechanical loading of the module.

Thermal resistance occurs at each interface of an assembly and affects overall system performance. In mechanically-clamped systems, the recommended flatness of interface surfaces should be within 0.001”. Even with this degree of flatness, interface materials must be used to fill in the small thermal gaps; typical choices include silicone-based thermal grease, graphite foil, and thermally-conductive pads.

Special care must be taken to insure that uniform pressure is applied during installation. Recommended procedures for mechanical clamping are illustrated in Figure 5.