Vacuum magnetron sputtering coating machine working principle:the so-called "splash", the electrons in

an electric field under the action of accelerating the process of flying to the substrate with argon atom

collision, ionization out large amounts of argon ions and electrons.The electron flies toward the substrate,

the argon ion speeds up the target material under the action of the electric field, sputtering out a large

number of target atom, and the neutral target atom (or molecule) is deposited on the substrate to form the

film.Secondary electron in accelerating to fly to the substrate by magnetic field in the process of lorentz

magnetic force, the influence of confined area near the target surface plasma, the plasma density in the

area is very high, secondary electron under the action of magnetic field around the target surface is

circular motion, the electron motion path is very long, constantly in the process of movement of the impact

ionization out large amounts of argon ion bombardment of target, after many times of collision of the

electron energy gradually reduce, cast off the yoke of the magnetic field lines, away from the target

material, the final deposition on the substrate.