ATOP Sanitary Ware Magnetron Sputtering Ion Chrome Plating PVD

Vacuum Coating Machine

2. It equipments cryogenic ion secondary source, some substrate without heating the material, It can

directly do the cold plating film at room temperature, save energy, increase productivity.

 

3. The maximum of the temperature for tool coating chamber can 600 degrees, In addition to the tool

Coater coating applications require heating device, other applications do not need the device.


4. Magnetron sputtering principle is based on the theory of the cathode glow discharge, it expend the

cathode surface magnetic field near the work piece surface. Then it improves the sputtered atom

ionization rate. It keeps the magnetron sputtering uniformity, also can improve the surface shining effect.


5. Vacuum pumping system, electric control system and complete vacuum coating system can be

customized according to user requirements.
 

Magnetron sputtering working principle of vacuum coating machine, the so-called "splash", under the

action of the electrons in an electric field accelerates to the substrate in the process of collision with argon

atoms, ionization out large amounts of argon ions and electrons.The electron flies toward the substrate,

the argon ion speeds up the target material under the action of the electric field, sputtering out a large

number of target atom, and the neutral target atom (or molecule) is deposited on the substrate to form the

film.Secondary electron in accelerating to fly to the substrate by magnetic field in the process of lorentz

magnetic force, the influence of confined area near the target surface plasma, the plasma density in the

area is very high, secondary electron under the action of magnetic field around the target surface is

circular motion, the electron motion path is very long, constantly in the process of movement of the impact

ionization out large amounts of argon ion bombardment of target, after many times of collision of the

electron energy gradually reduce, cast off the yoke of the magnetic field lines, away from the target

material, the final deposition on the substrate.