Au Gold Magnetron Sputtering Coating Machine On Silicon Wafers , Glass Slide , Ceramic Sheets
Au Gold Magnetron Sputtering Coating Machine On Silicon Wafers , Glass Slide , Ceramic Sheets
Au Gold Magnetron Sputtering on Silicon Wafers
Summary:
With PVD DC sputtering technology can deposit Au Gold metal thin film on glass slides, silicon wafers. Except Au gold deposition, other metal targets also available: Silver (Ag), Copper (Cu), Aluminum (Al), Chrome (Cr), Stainless Steel (SS316L), Titanium (Ti) to obtain either conductive of functional films or high glossary of aesthetic surface on various substrate materials.
The gold sputtering layer features:
1. Binding layer is essential to enhance substrate and metal film adhesion. Royal Technology has developed a range of matured coating recipes based on different applications, support our customers with professional advice.
2. The roughness (RMS - root mean square) < 40Å is expected for most of the applications. For certain scanning probe applications a lower roughness might be required, generally 1.5 ~ 4 nm.
4. Gold sputtering layer surface purity: a clean surface is required for applications that employ gold surface modifications. Depending on the PVD process used, level of vacuum in the system, original purity of the gold source (over 99.99% generally)
Keywords: Au gold nano-structure thin film deposition, Gold thin film magnetron sputtering, PVD gold sputtering, Gold Vacuum Metallizing System
Applications:
Laboratory of Universities, R&D department of metal materials manufactures, PVD Vacuum Coating Service Centers, mostly used in electronics industry as conductive layer and the sciences for microscope specimens etc.
Technical Specifications:
| MODEL | RTAC0808-SP |
| TECHNOLOGY | DC Sputtering + Ion source (for option) |
| MATERIAL | Stainless Steel (S304) |
| CHAMBER SIZE | Φ800*H800mm |
| CHAMBER TYPE | Cylinder, vertical, 1-door |
| ROTARY RACK SYSTEM | Planetary/Central driving |
| DEPOSITION MATERIAL | Gold, Aluminum, Silver, Copper, Chrome, Stainless Steel, Nickel, Titanium |
| DEPOSITION SOURCE | Cylindrical / Planar Sputtering Cathodes: 2 or 3 for option.+ 3 Arc sources |
| REACTIVE GAS CONTROL | MFC, 2/4 ways |
| CONTROL | PLC(Programmable Logic Controller) + Touch Screen |
| PUMP SYSTEM | SV300B - 1 set (Leybold) 300m³/hr |
| Roots Pump - 1 set, 150L/S | |
| Holding Pump - 1 set, 60m³/hr | |
| Turbo Molecular Pump: - 1 set, 3500L/S | |
| POWER SUPPLY |
Bias power supply: 1*24 KW DC sputtering power: 2*24KW |
| SAFETY SYSTEM | Numerous safety interlocks to protect operators and equipment |
| COOLING | Recycle Cooling Water |
| HEATING | Heaters, 9KW |
| POWER ELECTRICAL | 480V/3 phases/60HZ ( USA compliant) |
| 460V/3 phases/50HZ ( Asia compliant) | |
| 380V/3 phases/50HZ ( EU-CE compliant) | |
| FOOTPRINT | L3200*W2600*H2000mm |
| TOTAL WEIGHT | 3.0 T |
| CYCLE TIME | 30~40 minutes (depending on substrate material, substrate geometry and environmental conditions) |
| POWER MAX.. | 50KW |
| AVERAGE POWER CONSUMPTION (APPROX.) | 20KW |
PVD Gold Plating wafers
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.
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