DC And MF Magnetron Sputtering Coating Machine Deep Black PVD Coating Solutions
DC and MF Magnetron Sputtering Coating Machine, Deep Black PVD Coating Solutions
Magnetron Sputtering Coating
Plasma coating
Magnetron sputtering is a plasma coating process whereby sputtering material is ejected due to bombardment of ions to the target surface. The vacuum chamber of the PVD coating machine is filled with an inert gas, such as argon. By applying a high voltage, a glow discharge is created, resulting in acceleration of ions to the target surface and a plasma coating. The argon-ions will eject sputtering materials from the target surface (sputtering), resulting in a sputtered coating layer on the products in front of the target. Magnetron sputtering technology is characterized by:
- A water-cooled target, so little radiation heat is generated
- Almost any metallic target material can be sputtered without decomposition
- Non-conductive materials can be sputtered by using radio frequency (RF)
or medium frequency (MF) power - Oxide coatings can be sputtered (reactive sputtering)
- Excellent layer uniformity
- Very smooth sputtered coatings (no droplets)
- Cathodes (of up to 2 meter long) can be put in any position, therefore high
flexibility of sputtering equipment design
| MODEL | RTAC1250-SPMF | ||||||
| TECHNOLOGY | MF Magnetron Sputtering + Ion Plating | ||||||
| MATERIAL | Stainless Steel (S304) | ||||||
| CHAMBER SIZE | Φ1250 * H1250mm | ||||||
| CHAMBER TYPE | Cylinder, vertical, 1-door | ||||||
| SPUTTERING SYSTEM | Exclusively design for thin black film deposition | ||||||
| DEPOSITION MATERIAL | Aluminum, Silver, Copper, Chrome, Stainless Steel, Nickel |
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| DEPOSITION SOURCE | 2 sets MF Cylindrical Sputtering Targets + 8 Steered Cathodic Arc Sources + Ion Source For optional | ||||||
| GAS | MFC- 4 ways, Ar, N2, O2, C2H2 | ||||||
| CONTROL | PLC(Programmable Logic Controller) + | ||||||
| PUMP SYSTEM | SV300B - 1 set (Leybold) | ||||||
| WAU1001 - 1 sets (Leybold) | |||||||
| D60T- 1 set (Leybold) | |||||||
| Turbo Molecular Pumps: 2* F-400/3500 | |||||||
| PRE-TREATMENT | Bias power supply: 1*36 KW | ||||||
| SAFETY SYSTEM | Numerous safety interlocks to protect operators | ||||||
| COOLING | Cold Water | ||||||
| POWER ELECTRICAL | 480V/3 phases/60HZ ( USA compliant) | ||||||
| 460V/3 phases/50HZ ( Asia compliant) | |||||||
| 380V/3 phases/50HZ ( EU-CE compliant) | |||||||
| FOOTPRINT | L3000*W3000*H2000mm | ||||||
| TOTAL WEIGHT | 7.0 T | ||||||
| FOOTPRINT | ( L*W*H) 5000*4000 *4000 MM | ||||||
| CYCLE TIME | 30~40 minutes (depending on substrate material, substrate geometry and environmental conditions) |
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| POWER MAX.. | 155 KW | ||||||
| AVERAGE POWER CONSUMPTION (APPROX.) |
75 KW |
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.
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