Closed Field Unbalanced Magnetron Sputtering System, CE Certified PVD Ion Plating Machine
Closed field unbalanced magnetron sputtering deposition system, Unbalanced Magnetron Sputtering Ion Plating
Unbalanced and closed field magnetron processes have all the advantages of planar magnetrons. Additional advantages and disadvantages are:
- Additional ion bombardment resulting in dense, adherent films
- Ion assist and substrate cleaning possible
- Improved tribological, wear and corrosion resistant films
- Amenable to multilayer, superlattice, nanolaminant and nanocomposite films
- Poorer materials usage
- More complex cathode configuration/expense
Unbalanced and closed field magnetron sputtering revolutionized properties achievable by magnetron sputtering processes. As successful with improved thin film tribological, corrosion resistance and optical properties as this technology was, improvements in magnetron technology had just begun. Next Blog we move onto rotating and cylindrical magnetron processes and resulting thin film applications.
--- Above Artical from P E T E R M A R T I N
Royal technology developed high yield and high target utilization sputtering cathodes, especially for rare and expensive metals sputtering: Au Gold, Ta Tantalum, Ag silver metal films deposition. The high uniformity film's deposition system have been serving several industries like Electronics parts, medical instruments components which require high film uniformity, multiple layers deposition.
The RTSP1000 machine is a standardized machine developed by Royal technology. Extensive applied with cutting/forming tools, molds, medical instruments, electronics components, automotive industries.
| RTSP1000 Main Configurations and Technical Parameters | ||||||||
| MODEL | RTSP1000 | |||||||
| TECHNOLOGY | MF magnetron sputtering + ion source plasma cleaning | |||||||
| CHAMBER MATERIAL | Stainless Steel (S304) | |||||||
| CHAMBER SIZE | Φ1000*800mm (H) | |||||||
| CHAMBER TYPE | D shape | |||||||
| ROTATION RACK & JIG SYSTEM | 6 satellites Max. weight: 500kgs | |||||||
| POWER SUPPLIES |
Qty. of Sputtering: 2*24 KW Bias of Power Supply: 1*20W Ion Source Power supply 1*5KW |
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| DEPOSITION MATERIAL | Ti/Cr/TiAl /Ta/Cu/Au/Carbon etc. | |||||||
| DEPOSITION SOURCE | 2 pairs (4 pieces) Planar Sputtering Cathodes + 1 Linear Ion Source Uniformity Area: ±10~15% |
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| CONTROL | PLC(Programmable Logic Controller) + Touch Screen ( manual+ auto+ semi-auto operation models) | |||||||
| PUMP SYSTEM | Rotary Vane Pump: SV300B - 1 set (Leybold) | |||||||
| Roots Pump: WAU1001- 1 set (Leybold) | ||||||||
| Holding Pump: D60C- 1 set (Leybold) | ||||||||
| Magnetic Suspension Molecular Pump - 1 set (Leybold) | ||||||||
| GAS MASS FLOW CONTROLLER | 4 channels, Made in China, Seven Star (CS series, ) digital model | |||||||
| VACUUM GAUGE | Model: ZDF-X-LE, Made in China: ZDF-X-LE | |||||||
| LINEAR ION SOURCE | 1 piece Pre-treating, plasma cleaning + assisted deposition | |||||||
| SAFETY SYSTEM | Numerous safety interlocks to protect operators and equipment | |||||||
| HEATING | Heaters: 30KW. Max. temp.: 450℃ | |||||||
| COOLING | Industrial Chiller (Cold Water) | |||||||
| POWER MAX. | 100KW (Approx.) | |||||||
| AVERAGE POWER CONSUMPTION | 45 KW (Approx.) | |||||||
| GROSS WEIGHT | T (Approx.) | |||||||
| FOOT PRINT | ( L*W*H) 4000*4000 *3200 MM | |||||||
| POWER ELECTRICAL | AC 380V/3 phases/50HZ / 5 lines | |||||||
High target utilization planar sputtering deposition: please CLICK HERE to watch the video
Linear Ion Source Plasma Cleaning and Assisted Deposition: please CLICK HERE to watch video
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.
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