PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition
Circuit Board Conductive Thin Film Deposition by PVD DC Sputtering Process, Copper plating, Au Sputteringdeposition
------Large Capacity, Flexible Modules Design, Precised Manufacturing.
Technical Advantages:
The DPC-RTAS1215+ Sputtering system is the upgraded version of the original ASC1215 model, the newest system has several advantages:
Higher Efficient Process:
1. Double sided coating is available by turnover fixture design
2. Up to 8 standard planar cathode flanges for multiple sources
3. Large capacity up to 2.2 ㎡ ceramic chips per cycle
4. Fully Automation, PLC+Touch Screen, ONE-touch control system
Lower Production Cost:
1. Equipped with 2 magnetic suspension molecular pumps, fast starting time, free maintenance;
2. Maximum heating power;
3. Octagonal shape of chamber for optimum space using, up to 8 arc sources and 4 sputtering cathodes for fast deposition of coatings
The DPC process- Direct Plating Copper is an advanced coating technology applied with LED and semiconductors in electronic industries. One typical application is Ceramic Radiating Substrate. Copper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, has above all one big advantage compared to traditional manufacturing methods: DBC LTCC HTCC have much lower production costs.
Royal Technology’s team collaborated with our customer to develop the DPC process successfully applying PVD sputtering technology.
Applications of DPC:
HBLED
Substrates for solar concentrator cells
Power semiconductor packaging including automotive motor control
Hybrid and electric automobile power management electronics
Packages for RF
Microwave devices
Technical Specifications
| Description | DPC-RTAS1215+ |
| Chamber Height (mm) | 1500 |
| Chamber diameter (mm) | φ1200 |
| Sputtering Cathodes Mounting Flange | 4 |
| Ion Source Mounting Flange | 1 |
| Arc Cathodes Mounting Flange | 8 |
| Satellites (mm) | 16 x Φ150 |
| Pulsed Bias Power (KW) | 36 |
| Sputtering Power (KW) | DC36 + MF36 |
| Arc Power(KW) | 8 x 5 |
| Ion Source Power (KW) | 5 |
| Heating Power (KW) | 36 |
| Effective Coating Height (mm) | 1020 |
| Magnetic Suspension Molecular Pump | 2 x 3300 L/S |
| Roots Pump | 1 x 1000m³/h |
| Rotary Vane Pump | 1 x 300m³/h |
| Holding Pump | 1 x 60m³/h |
| Capacity | 2.2 ㎡ |
| Installation Area ( L x W x H) mm | 4200*6000*3500 |
HMI + Touch Screen Operation System
Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.