MB 5266 High Temperature Epoxy Tooling Block Plate Density 1.7 For Molds
LH®TOOL MB 5266 High temperature epoxy plate for TOOL molds
In terms of polyurethane board processing technology, LIHONG Group has been working hard to research and promote high temperature resistant resin boards. Our customers require high temperature carbon fiber prepreg applications above 200°F for high performance structural composites. After a lot of hard work and testing, MB5266 is finally on the international market
Designed for aerospace, defense and other structural applications where temperatures of 200-400°F are fairly common, LH's MB5266 is a solution! Do you use expensive materials to make MB5266 a solution for your one-off, prototype and short run needs.
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| Style No | Color | Density(g/cm3) | HardnessShore D | Coefficient Thermal Expansion (in./in./°F x 10-6K-1 |
Deflection Temperature(°C)1.82Mpa | Dimension(mm) | Characteristics and Application |
| LH-tool®5266MB | Beige | 1.70 | 88-90 | 40-45 | 120-150 | 1000x500x(50/75/100) 750x500x(50/75/100) | High density board, smooth surface, high temperature resistance, suitable for blister box, sand core box |
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