Shenzhen Shinelink Technology Ltd
                                                                                                           
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21 Years
Since 2005
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HDI heavey copper pcb , 2oz coper pcb prototype with fast delviery

Price Negotiable
Price: Negotiation
MOQ: 1pc
Delivery Time: 5-7 days
Brand: No
Product Description

Green soldemask heavey copper pcb double sided copper clad board

 

 

PCB capability and services
 

1. Single-sided, double side and multi-layer PCB. FPC. Flex-Rigid PCB with competitive price, good quality and excellent service.
2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
5. Quantities range from Sample to mass order
6.100% E-Test
7. Qualified for CE and RoHS certificate

 

PCB Feature

 

Number of Layer 1 - 20 Layer
Maximum Processing Area 680 × 1000MM
Min Board Thickness 2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending ≤ 0.75%, Min: 0.5%
Range of TG 130 - 215 ℃
Impedance Tolerance ± 10%, Min: ± 5%
Hi-Pot Test Max: 4000V/10MA/60S
Surface Treatment HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP

 

Quick Leadtime


Lead time for sample
2-3 days for single-sided board
4-5 days for double-sided board
6-7 days for multilayer board
24-48 hours for urgent
Lead time or opening Mould:
3-5 days for normal mould
5-7 days for hard mould
Lead time for mass production
5-7 days for single/double sided board
7-10 days for multilayer board


PCBA capability and services SMT (Surface mounting technology), COB, DIP.
 

1. Material Sourcing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
6. OEM/ODM also welcomed

What we need


1. Gerber files of the bare PCB
2. Bill of materials to include: Manufacturer's part number, type of part, type of packaging, component locations listed by reference designators and quantity
3. Dimensional specifications for non-standard components
4. Assembly drawing, including any change notices
5. Final test procedures (if available)

Packing Terms


1. Inner packing. All the goods will be packed by vacuum
2. Outer packing. Standard carton

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Shinelink Technology Ltd
Location Room 201 Building A2 Industrial Park No. 6 Yuanchuang Park Rongfu road, Fucheng Street Longhua District Shenzhen City 518131
Contact Person Sandy

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