Shenzhen Shinelink Technology Ltd
                                                                                                           
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21 Years
Since 2005
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Fr-4 Halogen FreeTurnkey PCB Assembly Circuit Board Assembly 0.35mm Thickness

Price Negotiable
Price: Negotiable
MOQ: 1pc
Delivery Time: 5-7 days
Brand: OEM/ODM
Product Description

Fr-4 Halogen FreeTurnkey PCB Assembly Circuit Board 0.35mm Thickness

 

 

Key Specifications/Special Features:

 

BOM

Gerber file

Assembly drawing with any change notices

Dimension specifications for non-standard components

Test standard operation procedures

Please offer us acceptable components for substitution so as to shorten the lead time

If possible, please send prototype sample board to us for further reference.

We commit to offer high quality level circuit board to customer

Abundant experience and strong ability in material sourcing,manufacturing,test and quality management

Professional team in charge of product design

Circuit boards 1 to 28 layers PCB layout, fabrication, PCB assembly and box building

High-precision 0201 size components SMT technology

RoHS complaint SMT, DIP process

High-precision e-testing include: ICT in circuit,function test,AOI,BGA repair device and more

Flexible production volume follow different customer requirement

We offer quotation for clients within 3 working days and reply e-mail within 6 hours

 

 

Our services for the PCB Assembly

 

Re-layout for shortening the board size

Bare pc board fabrication

SMT/BGA/DIP assembly

Full component procurement or the substitute components sourcing

Wire harness and cable assembly

Metal parts, rubber parts and plastic parts including mold making

Mechanical, case and rubber molding assembly

Functional testing

Repairs and inspection of the sub-finished / finished goods

 

 

Our capabilities for the PCB Assembly

 

Stencil Size Range

736 mm x 736 mm

Min. IC Pitch

0.30 mm

Max. PCB Size

410 mm x 360 mm

Min. PCB Thickness

0.35 mm

Min. Chip Size

0201 (0.6 mm X 0.3 mm)

Max. BGA Size

74 mm X 74 mm

BGA Ball Pitch

1.00 mm (Min) / F3.00 mm (Max)

BGA Ball Diameter

0.40 mm (Min) /F1.00 mm (Max)

QFP Lead Pitch

0.38 mm (Min) /F2.54 mm (Max)

Frequency of Stencil Cleaning

1 time / 5 ~ 10 Pieces

 

 

 

 

 

 

 

 

 

 

 

 

 

PCBA Picture

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Shinelink Technology Ltd
Location Room 201 Building A2 Industrial Park No. 6 Yuanchuang Park Rongfu road, Fucheng Street Longhua District Shenzhen City 518131
Contact Person Sandy

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