Materials

Standard

Advanced

FR4 (130‐180 Tg by DSC)

Y

Y

Halogen Free

Y

Y

BT Epoxy

Y

Y

Getek

Y

Y

Isola 370HR 406 408 IS410 IS 420 IS620

Y

Y

Nelco 4000

Y

Y

Rogers 4000

Y

Y

PTFE

Y

Y

Dupont Pyralux

N

Y

Aluminum Core

Y

Y

Surface Finishes

ENIG

Y

Y

Flash Gold

Y

Y

Electrolytic Nickel/Hard Gold

Y

Y

HASL

Y

Y

Lead Free HASL

Y

Y

Immersion Ag

Y

Y

Standard Features

Standard

Advanced

Maximum layer count

20

36

Maximum Panel Size

21″x24″

24″x30″

Outer Layer Trace/Spacing (1/3 oz)

0.0035″/0.0035″[90μm/90μm]

0.0025″/0.003″[64μm/76μm]

Inner Layer Trace/Spacing (H oz)

0.003″/0.003″ [76μm/76μm]

0.002″/0.0025″ [50μm/64μm]

Maximum PCB thickness

0.125″[3.2mm]

0.177″[4.5mm]

Minimum PCB thickness

0.008″[0.20mm]

0.004″[0.10mm]

Minimum mechancial drill size

0.008″[0.20mm]

0.004″[0.10mm]

Maximum PCB aspect ration

10:01

12:01

Maximum copper weight

5 oz [178μm]

6 oz [214μm]

Minimum copper weight

1/3 oz [12μm]

1/4 oz [9μm]

Minimum core thickness

0.002″[50μm]

0.0015″[38μm]

Minimum dielectric thickness

0.0025″[64μm]

0.0015″[38μm]

Minimum Pad Size over Drill

0.018″[0.46mm]

0.016″[0.4mm]

Solder Mask Registration

+/‐ 0.002″[50μm]

+/‐ 0.0015″[38μm]

Mimimum Solder Mask Dam

0.003″[76μm]

0.0025″[64μm]

Copper feature to PCB edge

0.015″[0.38mm]

0.010″[0.25mm]

Tolerance on overall dimensions

+/‐ 0.004″[100μm]

+/‐ 0.002″[50μm]

HDI Features

Immersion Tin

Y

Y