High Automation Bga X Ray Machine For Dry Joint Detection And Analysis
Dry joint detection and analysis BGA X-Ray Inspection Machine
X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. ( Offline X - Ray series ) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on.
| Item | Definition | Specs |
| Motion Control System | Motion Control Mode | Mouse&Joystick&Keyboard |
| Max.Load Dimension | 500x500mm | |
| Max.Detection Dimension | 350x450mm | |
| Tilt Detection Angle | 60° | |
| X-Ray System | Tube Type | Closed |
| Voltage/Current | 100kv/200μA | |
| Focal Spot Size | 5μm | |
| FPD Detector | FPD | |
| Physical & Image Processing Parameters | Length x Width x Height | 1250 x 1300 x 1900 mm |
| Weight | 1500 kg | |
| Power | 2kW | |
| System Magnification | 500 x | |
| Leakage Dose | <1μSv/h |
X-ray Inspecting Features:
(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.
(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such
as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.
(3) The test preparation time is greatly reduced.
(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.
(5) Double layers board and multi-layer boards only one check (with layered function).
(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.
Inspection Images:
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