Unicomp AX7900 High Specifications 2D 2.5D X-Ray Machine for Cellphone Inspection and Cracks Checking
Price:
can negotiate
MOQ:
1Set
Delivery Time:
30 days
Brand:
UNICOMP
Product Description
High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking
Description of IC X Ray machine AX7900:
It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others.
FEATURES of IC Xray machine AX7900:
-
A Large-Scale Laser Pinpoint Inspection Table for Accurate Localization
Achieving Precise Automatic Positioning through CNC Programming and Exact Control - FPD Tilting ±25
- Electromagnetic Safety Interlock
- Fingerprint-Based Access Control System
- Instantaneous Radiation Surveillance
Technical Specifications of AX7900
| Item | Definition | Specs |
| System Parameters | Size | 1280(L)x1220(W)x1615(H)mm |
| Weight | 1100kg | |
| Power |
AC 110/220V, 50/60Hz
|
|
| Power Consumption | 1.0kW | |
| X-ray Tube | Type |
Sealed
|
| Max.Voltage |
0~90kV (Adjustable)
|
|
| Max.Power | 8W | |
| Spot Size | 5μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 224‘’LCD | |
| System Magnification | 600X | |
| Detection Region | Max.Loading Area | 520mm x 420mm |
| Max.Inspection Area | 460mm x 400mm | |
| X-ray Leakage | <1μSv/h
(Meets All International Standards)
|
|
Inspection Images of IC X Ray machine AX7900:
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Company
Unicomp Technology
Location
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person
James Lee