UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100
Metal X Ray Machine for BGA connectivity and analysis AX9100
| Item | Definition | Specs |
| System Parameters | Size | 1350(L)x1250(W)x1700(H)mm |
| Weight | 1900kg | |
| Power | 220AC/50Hz | |
| Power Consumption | 1.6kW | |
| X-ray Tube | Type | Closed |
| Max.Voltage | 130kV | |
| Max.Power | 40W | |
| Spot Size | 7μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 22 ‘’LCD | |
| System Magnification | 1600 X | |
| Detection Region | Max.Loading Size | Φ570mm |
| Max.Inspection Area | 450mm x 450mm | |
| X-ray Leakage | <1μSv/h | |
Applications
Solder reflow analysis
BGA connectivity and analysis
Solder void calculation
Through hole measurement and inspection
Die attach voiding measurement
Ball bond analysis
Stitch bond analysis
Micro BGA / chip on chop analysis
Pad array analysis
Dry joint detection and analysis
Installation
Unicomp will provide installation and calibration service at the customers location Installation includes assistance in registering your new x-ray system with local and state agencies where applicable. One (1) on-site radiation survey at the time of installation with supporting documents.
Test Images:
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