Co-Polyamide Hot Melt PA Adhesive Tape High Temperature Double Sided for SIM Cards
Co-Polyamide Hot Melt PA Adhesive Tape High Temperature Double Sided for SIM Cards
Hot Melt Adhesive Tape Product: DS-4
Hot Melt Adhesive Tape Description:
The hot melt adhesive is used for embedding of contact smart cards. Excellent adhesion to PVC, FR-4 and other materials.This product belongs to hot-melt tape with low and medium temperature properties. Very strong cohesion and good flexibility to ensure that no structural fracture will occur in the thrust and bending tests after bonding, while maintaining a balanced bond strength with the chip and the card base, and has excellent punchability. Meet the requirements of ISO7816 standard for chip package fastness.
Hot Melt Adhesive Tape Composition:
Copolyamide
Hot Melt Adhesive Tape Application Field:
DS-4 is suitable for heat embedding of IC cards, SIM cards, financial social security cards, and contact bank cards.
Hot Melt Adhesive Tape Physical Characteristics:
| Color | Light Yellow | Release Protection | Glassine Release Paper |
| Proportion | 1.08±0.02g/cm³ | Conventional Thickness | 0.055mm±0.008mm |
| Melting Range | 70-95℃ (Tunsing DSC 214) | Conventional Width | 29.2mm |
| Melt Flow Index | 75±25g/10min(ASTM D1238-04) | Conventional Length | 200m |
| Hardness | D 58±2 (Shore ) | Finished Product | 0.055mm*29.2mm*200m |
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