Double Side Copolyamide Hot Melt Adhesive Tape S-T170 For Bonding Smart Card
S-T170 Copolyamide Hot Melt Adhesive Tape for Bonding Smart Card
DS-4 Production description:
This product is mainly applied used for bonding SIM card.
DS-4 specication:
Thickness * width * length: 55μm*29mm*200m
DS-4 Data:
DS-4 Detail image:
DS-4 Packing
Packaging Details: Vacuum packing, 200m/roll, 20rolls/CTN.
Delivery Detail: Shipped in 3-5 days after payment.
DS-4 Test equipment:
Our DS-4's thrust force is 120N, and bend test can do the 6000 times.
Our company
Shenzhen Tunsing Plastic Products Co., Ltd
Shenzhen Tunsing Plastic Products Co., Ltd ,was founded in 2002. Through ten years of the journey of developed hot melt adhesive film and professional technical teams on high-molecular technique. Collects together research and development (R&D), production and sale. From the raw materials to film are strictly accords with ISO9001.
Commercial criterion: Offer the original solution for the sustainable development of Customers, building stable and sustained customer relationship.
Enviromental protection: Offer the practical and effective products and scheme for ourselves and clients, In order to meet the requirements of environmental.
Enterprising spirit: innovation, efficiency, devotion
Corporate vision: Become a model enterprise based on commercial criterion and Business Ethics.
Corporate Mission: With a continued technological innovation, to improve manufacturing process and promote social progress.
Corporate values: Respect, Honest, Integrity.
Certifications
Exhibition picture
Smart Cards Expo 2018
Contact Me
Tel &whatsapp & wechat: 86 181 2626 6193
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