Co Polyamide Double Side Hot Melt Adhesive Tape 29Mm Width For SIM Card
29Mm Width Co-Polyamide Double Side Hot Melt Adhesive Tape for SIM Card
Hot Melt Adhesive Tape Product: DS-4
Hot Melt Adhesive Tape Description:
Hot Melt Adhesive Tape is used in the encapsulation of contact smart card. Excellent adhesion to PVC, FR-4 and other materials.
The hot melt adhesive tape belongs to medium and low temperature . The strong cohesive force and good flexibility ensures that the thrust and bending tests after bonding will not show any structural fracture while maintaining a balanced bond strength with the chip and the base. In line with ISO7816 standard for chip packaging fastness.
Hot Melt Adhesive Tape Applications:
DS-4 is suitable for thermal packaging of IC card, SIM card, financial social security card and contact bank card.
Hot Melt Adhesive Tape Composition:
Polyamide synthesis modification
Hot Melt Adhesive Tape Physical Characteristics:
Hot Melt Adhesive Tape Recommended Bonding Conditions:
| Mechanical Mold Temperature | 140℃-160℃ | Mechanical Mold Temperature | 160℃-180℃ |
| Adhesive Time | 0.6S-1.2S | Packing Time | 0.6S-1.2S |
| Pressure | 0.25-0.4mpa | Pressure | 0.25-0.4mpa |
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