New Lead Free Reflow Machine Reflow Oven Siemens Control System With Clear LED Display

Reflow soldering cooling zone

After the solder paste turns into a liquid, it can be cooled down. The faster the cooling rate, the faster the cooling rate is, the more likely it is to produce a gray roughness. It is usually solidified by cooling to 75 ° C, and the PCB board is realized. Soldered.

Features

1. Due to the unique way to transport wind, surrounded by the return air patented design that eliminates the effects of the rail on PCB board to undesirable temperature, on PCB board of heating, it is more evenly and quickly than similar models

2. Unique furnaces are the wind structure within different areas of the furnace can be different wind speed difference arising due to structure adjustment, heat uniform.

3. Adopting imported high temperature motors, speed by Inverter control, long-term use, quality and stability

Material

Parameter:

Reflow classification:

Reflow soldering techniques are classified according to heating methods: vapor phase reflow soldering, infrared reflow soldering, infrared hot air reflow soldering, laser reflow soldering, hot air reflow soldering, and tool heating reflow soldering.

Reflow soldering is a production equipment used for soldering electronic components and circuit boards.

Patent:

Our company obtains a number of intellectual property technologies, including 9 invention patents,12 software copyright

Delivery deadline:

Around 4 weeks after payment.

Exported:

We have exported more than 20 countries, such as USA, Korea, India, Germany, Eygpt, Turkey, Vienam, Tunisia, etc.