High Performance Ultrasonic Soldering Equipment for dip tinning Aluminum wire

Ultrasonic Soldering Machine ( Dip Soldering Type ) offers highly solid and reliable soldering joints without flux.

The Solbraze Ultrasonic Soldering System makes possible the dip tinning of a wide range of both metallic and non-metallic materials without the use of any flux.

The ultrasonic soldering system consists of two main components; an ultrasonic probe and a generator. The design of the probe is such that it will resonate at a set ultrasonic frequency of around 20kHz which is transmitted to the solder bath via a transducer and ultrasonic probe, or sometimes referred to as an energy horn. This horn or probe enters through the side of the solder bath and is partially immersed in the solder. The generator will automatically adjust its output frequency to match the exact resonant frequency of the probe assembly. The generator also controls the amplitude of the ultrasonic vibration, and will give a maximum power output of 250W.

The system is usually used with a solder bath which has an element rating of 700W and a capacity of approx. 10 kgs. There is a solder temperature light on the front of the generator which is not in use during operation without a solder bath.

It is essential that the ultrasonic transducer remains cool, and because of this the transducer housing is fitted with a fan, and compressed air is supplied to the cooling collar on the probe. If the supplied system is used with small components heated by hot air, it is likely that the compressed air cooling will not be required.

When to use Ultrasonic Soldering

There are two main reasons for using Ultrasonic Soldering:

1. To eliminate the need for flux in the soldering process

2. To apply solder to ceramics and similar materials

The advantages of removing flux from the process are that there is no need for post-process

cleaning and wicking caused by surface tension from the flux is removed. Eliminating post-process

cleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit of

eliminating wicking is that the solder coating on the base material can be better controlled.

Application

• Electronic Components Soldering (No Flux)
• Magnet Wire (Al or Cu) Product Soldering Motor / Transformer / Inductor / Toroidal Coil
• Soldering (No Flux)
• Battery Electrode Soldering
• Hard-to-solder material soldering (Aluminum, Nickel, Molybdenum, Glass, Ceramic, Nonferrous metals)

Parameter:

Characteristics

• Easy soldering upon un-bondable material (metal, glass, ceramics) by simple dipping process.

• No need for flux

• Reliable bonding/sealing

• Best used in difficult, small-surface places with limited access

Application coating on:

• Aluminum components

• Ferrite components

• Glass components

• Silicon wafers

• Ceramic components

• Semiconductor chips

• Metals etc.