H5TQ4G63CFR-RDC DDR3 DRAM Memory Chip 4Gb 256Mx16 1.5V 96-pin FBGA Surface Mount
Price:
Negotiation
MOQ:
1 package
Delivery Time:
3-5 work days
Product Description
H5TQ4G63CFR-RDC DDR3 DRAM Memory Chip Overview
The H5TQ4G63CFR-RDC is a high-performance 4Gb DDR3 SDRAM memory chip designed for applications requiring substantial memory density and superior bandwidth. This 256M x 16 organization component operates at 1.5V with surface mount compatibility, delivering reliable performance for industrial computing systems.
Key Technical Features
- 4Gb density with 256M x 16 organization
- 1.5V operating voltage with low power consumption
- 934.57 MHz maximum clock frequency
- 8-bank architecture with programmable CAS latency
- PBGA96 package with surface mount design
- 0°C to 95°C operating temperature range
- On-chip DLL for precise timing alignment
- Dynamic On Die Termination support
- ZQ calibration and asynchronous RESET functionality
Technical Specifications
| Parameter | Specification |
|---|---|
| Density | 4 Gb |
| Organization | 256M x 16 |
| Operating Voltage | 1.5 V |
| Maximum Clock Rate | 934.57 MHz |
| Package Type | 96-pin FBGA |
| Operating Temperature | 0°C to 95°C |
| Data Bus Width | 16 Bit |
| Mounting Style | Surface Mount |
| Maximum Operating Current | 55 mA |
Compliance & Classification
ECCN: EAR99
UNSPSC: 32101602 (Semiconductor Memory Circuits)
Performance Characteristics
This DDR3 SDRAM features fully synchronous operation with differential clock inputs and data strobes. The 8-bit prefetch architecture enables high bandwidth performance, while programmable burst length and CAS latency options provide flexibility for various system requirements. The component supports commercial temperature range operation with reliable refresh cycle management.
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol