KMFN60012M-B214 EMCP Memory Chip 8GB eMMC + 8GB LPDDR3 1866MHz 221FBGA Package
Price:
Negotiation
MOQ:
1 piece
Delivery Time:
3-5 work days
Product Description
KMFN60012M-B214 EMCP Memory Chip Overview
The KMFN60012M-B214 is an advanced eMCP (embedded Multi-Chip Package) memory solution combining 8GB eMMC storage and 8GB LPDDR3 RAM in a single 221FBGA package. This integrated memory chip delivers high-performance storage and memory capabilities optimized for embedded systems and mobile applications.
Key Technical Specifications
| Part Number | KMFN60012M-B214 |
| eStorage Capacity | 8GB |
| eStorage Version | eMMC 5.1 |
| DRAM Capacity | 8GB |
| DRAM Type | LPDDR3 |
| Operating Speed | 1866 Mbps |
| Package Type | 221FBGA |
Performance Features
- Dual 8GB configuration (8GB eMMC + 8GB LPDDR3) for balanced performance
- High-speed LPDDR3 memory operating at 1866MHz frequency
- Latest eMMC 5.1 interface for enhanced storage performance
- Compact 221FBGA package saves board space and simplifies design
- Ideal for space-constrained embedded systems and mobile devices
Application Note: This EMCP memory chip is designed for industrial-grade embedded systems, smartphones, tablets, and IoT devices requiring reliable high-performance memory in a compact form factor.
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol