KMFNX0012M-B214 EMCP Memory Chip 8GB eMMC + 8GB LPDDR3 1866MHz 221FBGA Package
Price:
Negotiation
MOQ:
1 piece
Delivery Time:
3-5 work days
Product Description
Product Overview
The KMFNX0012M-B214 EMCP memory chip combines 8GB eMMC storage and 8GB LPDDR3 RAM in a single 221FBGA package, delivering high-performance memory solutions for embedded systems and mobile devices.
Technical Specifications
| Part Number | KMFNX0012M-B214 |
| Storage Capacity | 8GB eMMC |
| Storage Version | eMMC 5.1 |
| DRAM Capacity | 8GB LPDDR3 |
| Operating Speed | 1866 Mbps |
| Package Type | 221-ball FBGA |
Key Features
- Integrated eMMC 5.1 storage and LPDDR3 memory in single package
- High-speed 1866MHz operation for optimal performance
- Compact 221FBGA package saves board space
- 8GB + 8GB configuration for balanced storage and memory
- Ideal for embedded systems and mobile applications
Industrial Application: This EMCP memory solution is designed for reliable performance in demanding industrial environments, supporting high-speed data processing and storage requirements in embedded computing systems.
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol