SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
                                                                                                           
Verified Supplier
17 Years
Since 2009
Menu

KMQX10013M-B419 eMCP Memory Chip 32GB eMMC 5.1 + 16Gb LPDDR3 1866MHz 221-ball FBGA Package

Price Negotiable
Price: Negotiation
MOQ: 1 piece
Delivery Time: 3-5 work days
Product Description
Product Overview

KMQX10013M-B419 eMCP memory chip combines 32GB eMMC flash storage with 16Gb LPDDR3 DRAM in a single 221-ball FBGA package, delivering high-performance embedded memory solution for mobile and industrial applications.

Technical Specifications
Parameter Specification
Flash Storage Capacity 32 GB
Flash Storage Version eMMC 5.1
DRAM Capacity 16 Gb (2 GB)
DRAM Type LPDDR3
Operating Speed 1866 Mbps
Package Type 221-ball FBGA
Key Features
  • Integrated eMCP solution combining flash and DRAM in single package
  • High-speed 1866 MHz LPDDR3 memory for optimal performance
  • 32GB eMMC 5.1 flash storage with advanced error correction
  • Compact 221-ball FBGA package saves board space
  • Ideal for smartphones, tablets, and embedded systems
Availability: Currently in mass production

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person Carol

Request A Quote

Please check your email address.
Your message must be at least 20 characters.