JL82576EB SLJBH Mobile Chipset - 25mm x 25mm BGA Package with PCIe v2.0 Interface and Dual Port Configuration
Price:
Negotiation
MOQ:
1 piece
Delivery Time:
3-5 work days
Product Description
JL82576EB SLJBH Mobile Chipset - Northbridge & Southbridge
Key Product Specifications
Package Size: 25mm x 25mm BGA | System Interface: PCIe v2.0 (2.5 GT/s) | Port Configuration: Dual
Networking Features
- Dual port configuration for enhanced connectivity
- PCIe v2.0 system interface (2.5 GT/s)
- NC Sideband Interface support
- Jumbo Frames support for improved data transfer
- MACsec IEEE 802.1 AE security protocol
- IEEE 1588 precision timing protocol
Advanced Technologies
- Intel Virtualization Technology for Connectivity (VT-c)
- VMDc (SR-IOV with mobility) support
- VMDq virtualization technology
- Intel I/O Acceleration Technology (I/OAT)
Package & Environmental Specifications
- Compact 25mm x 25mm BGA package
- Low halogen options available (refer to MDDS)
Compatibility Notes
Fiber Channel over Ethernet: Not supported | Intel vPro™ Technology: Not supported
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Company
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Location
ZHUOYUEHUI A2603 ZHUOYUEHUI CENTER PLAZA(SOUTH AREA) NO.126 ZHONGKANG ROAD MEIDU COMMUNITY MEILIN STREET
Contact Person
Carol