The Infrared Picosecond Dual-Platform Glass Laser Cutting

 Equipment is a high-precision, high-efficiency industrial-grade solution designed for the advanced processing of hard and brittle materials such as quartz glass and synthetic sapphire. Utilizing ultra-short picosecond laser pulses in the infrared spectrum, this system delivers clean, crack-free cuts with minimal thermal damage, making it ideal for semiconductor substrates, optical components, and high-end consumer electronics.

The Characteristic Parameters of Infrared picosecond dual-platform glasslaser cuttingequipment

Process application

Suitable for cutting all kinds of hard and brittle materials, such as ordinary glass, optical glass, quartz, sapphire, reinforced glass, filter, mirror and other shape processing, specific size can also achieve theinner hole.

Processing advantages of Infrared picosecond dual-platform glasslaser cutting equipment

-The dual-platform cutting and splitting is integrated and flexible to use;

-High-speed processing of special-shaped workpieces improve sprocess conversion efficiency;

-The cutting edge has no taper, small edge collapse,and does not hurt the hand;

-The production of various specifications of products is seamlessly switched,and the operation is simple and easy to use;

-The operating cost is low,the yield rate is high,there are no consumables,and there is no pollution; no waste residue,waste liquid,or waste water is generated and the product surface will not be scratched.

Image of glass laser cutting sample

Q&A

Q: How does laser cutting technology work?

A: Laser cutters use a thin, focused laser beam to pierce and cut through materials to cut out patterns and geometries specified by designers.

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