Fused Quartz Wafers High Purity Thermal Stability and Optical Clarity for Advanced Applications

Product Overview of  Fused Quartz Wafers

“Fused Silica” or “Fused Quartz” which is the amorphous phase of quartz (SiO2). When contrasted to borosilicate glass, fused silica has no additives; hence it exists in its pure form, SiO2. Fused silica has a higher transmission in the infrared and ultraviolet spectrum when compared to normal glass. Fused silica is produced by melting and re-solidifying ultrapure SiO2. Synthetic fused silica on the other hand is made from silicon-rich chemical precursors such as SiCl4 which are gasified and then oxidized in a H2 + O2 atmosphere. The SiO2 dust formed in this case is fused to silica on a substrate. The fused silica blocks are cut into wafers after which the wafers are finally polished.

Key Features and Benefits of Fused Quartz Wafers

• Ultra-high purity (≥99.99% SiO₂)
  Ideal for contamination-sensitive processes in semiconductors and photonics.

• Wide temperature range
  Withstands cryogenic to >1100°C thermal environments without deformation.

• Exceptional UV and IR transmittance
  Offers excellent optical clarity from deep ultraviolet (DUV) to near-infrared (NIR).

• Low thermal expansion
  Ensures dimensional stability under thermal cycling, reducing component stress.

• Chemical inertness
  Resistant to most acids, bases, and solvents; perfect for harsh process conditions.

• Surface quality control
  Available in ultra-smooth, double-side polished formats for optical and MEMS applications.

Manufacturing Process

Fused quartz wafers are produced through the following steps:

1. Raw Material Selection: High-purity natural quartz sand or crystals are selected and purified.

2. Melting and Fusion: Quartz granules are melted at ~2000°C in electric furnaces under controlled atmosphere to remove bubbles and impurities.

3. Solidification and Block Forming: The molten material is cooled into solid ingots or blocks.

4. Wafer Slicing: Precision wire saws cut the solidified fused quartz into wafer blanks.

5. Lapping and Polishing: Wafer surfaces are ground, lapped, and polished to achieve exact thickness and flatness.

6. Cleaning and Inspection: Final wafers are ultrasonically cleaned in Class 100/1000 cleanrooms and inspected for defects.

Applications

Fused quartz wafers are used across industries requiring optical transparency, thermal durability, and chemical resistance:

Semiconductors

• Carrier wafers in high-temperature processes

• Diffusion and ion implantation masks

• Etching, deposition, and inspection platforms

Photonics & Optics

• Substrates for optical coatings

• Laser windows and beam splitters

• Precision UV and IR optical components

Laboratory & Research

• Sample carriers for analytical instruments

• Microfluidic and chemical analysis platforms

• High-temperature reaction substrates

LED & Solar

• Furnace wafers for LED chip fabrication

• Substrates in photovoltaic cell R&D

Available Specifications

Technical Advantages

• Glass-like structure eliminates birefringence found in crystalline quartz

• No crystal axis—ideal for isotropic behavior in optical applications

• Non-porous, smooth surface for improved cleanliness and coating adhesion

• Suitable for bonding, dicing, and photolithography

• Low OH content grades available for improved UV durability

Frequently Asked Questions (FAQ)

Q1: What’s the difference between fused quartz and fused silica?
Both refer to amorphous SiO₂, but “fused silica” often implies synthetically produced high-purity glass, while “fused quartz” is derived from natural quartz. Their properties are nearly identical in most applications.

Q2: Can fused quartz wafers be used in high-vacuum environments?
Yes, fused quartz has extremely low outgassing and high thermal stability, making it ideal for vacuum systems and space applications.

Q3: Are these wafers suitable for UV laser applications?
Absolutely. Fused quartz exhibits excellent transmission in the deep UV range (down to ~185 nm), making it well-suited for DUV laser optics and photomask substrates.

Q4: Do you offer customization?
Yes, we manufacture wafers based on customer requirements including diameter, thickness, surface finish, and laser cutting patterns.