• High Density: 16.5-18.75 g/cm³ specific gravity
• Exceptional Strength: 700-1000 MPa tensile strength
• Superior Radiation Absorption: 30-40% higher than lead
• Excellent Thermal Conductivity: 5 times that of die steel
• Low Thermal Expansion: Only 1/2-1/3 of iron or steel
• Good Electrical Conductivity: Ideal for lighting and welding applications
• Excellent Weldability & Workability: Easy to process and fabricate

Vapor chambers provide significantly enhanced thermal performance compared to traditional solid metal heat spreaders in CPU coolers and electronic cooling systems. These two-phase heat transfer devices feature a large, flat surface that efficiently distributes heat from high-power electronics.

Key advantages include:

• Reduces conduction loss (Delta-T) by 50% or more
• Lowers overall thermal resistance in thermal assemblies
• Accommodates variations in component height along PCBs
• Available in sizes up to 400mm for electronics cooling

Available in standard sizes from 10-30mm or fully customized dimensions to meet specific application requirements. Surface finishes include polished or customer-specified treatments.