High Q Thin Film Chip Inductor AIML0805C 1.0-470nH 300mA for Bluetooth and GPS Modules

AIML0805C Ceramic chip inductors

The AIML0805C series ceramic chip inductor is manufactured using advanced thin-film technology. Inductance range covers 1.0nH to 470nH. Rated current is 300mA. It offers high self-resonant frequency and low DCR. The 0805 package (2.0*1.25mm) with leadless design is suitable for high-density surface-mount applications. The enamel glass coating provides high precision and low resistance drift. It offers excellent solderability, thermal shock resistance, and is compatible with both wave soldering and reflow soldering processes. Micro-size options such as 0402C/0603C are also available. It is widely used in high-frequency RF circuits, wireless communication, Bluetooth modules, GPS, mobile phones, and various high-frequency filtering and matching networks.

Features:

1. Advanced thin film technology
2. Miniature size 0402C/0603C available
3. Small size, no lead is suitable for high-density surface mount
4. Low resistance value of the highB
5. Excellent solderability and heat shock
6. Suitable for wave soldering and reflow soldering
7. Enamel-coated glass and high precision, small resistance drift
8. Environmentally friendly products

Applcations:

1. Medical Equipment
2. Testing/Measurement Equipment
3. Printer Equipment
4. Automatic Equipment Controller
5. Converters
6. Communication Device, Cell phone ,GPS ,PDA
7. Personal Computers
8. Portable Equipment
9. CD-ROM, Hard Disk, Modem, Printers
10. DC - DC converters
11. DSC, DVC, PDA, DVD and HDD

Technical information:

1. Solderability:90% of the terminal Electrode shall be covered Preheat:@ 260℃±5℃ for 160 seconds Solder:H63AA Eutectic Solder Flux:Rosin,Dip for 5 seconds ±1 second
2. Thermal Shock: lnductance shall be Within±5% of imitial value and Q shall be within ±30% of initial value When temperaturs is -40℃ and +85℃ for 30 Min.for each 100 cycles
3. Operating Temperature:-25℃ to +85℃
4. Storage Temperature: -40℃ to +85℃

Note:All specifications subject to change without notice.

FAQ

Q: What are the advantages of thin-film technology compared to multi-layer ceramic technology?

A: Thin-film technology uses photolithography processes for manufacturing, offering higher precision, tighter inductance tolerance, and lower parasitic parameters. It provides higher Q factor and higher self-resonant frequency at high frequencies, making it especially suitable for RF and microwave applications. Multi-layer ceramic technology is lower in cost and suitable for general high-frequency applications.

Q: What is the size of the 0805 package?

A: The 0805 package size is 2.0*1.25mm (length * width), with a leadless design suitable for high-density surface-mount applications. Smaller size options such as 0402C/0603C are also available in this series.

Q: What are the advantages of enamel glass coating?

A: Enamel glass coating provides high precision and low resistance drift, ensuring the inductor maintains stable electrical performance under temperature changes and long-term use, improving product reliability.