8w compatible lighting design diferent color temperatures tunable

-No CSP,No CSC package, more temperature resistant.

-ABAB  distribution alignment process Intelligent stepless dimming space.

-Better light quality, 3 SDCM matched withfull range of tunable drivers .

The part number designation for TYF ML Series LED arrays is explained as follows:

5.1 Color Binning Information

Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)

RECOMMENDED SOLDERING CONDITION

For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a

temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied

to resin part while soldering is implemented. Next process of soldering should be carried out after the product has

return to ambient temperature. CAUTION: TEMPERATURE CONTROL

9,Packaging and Labeling

Product Packing and Labeling