Low-Molecular-Weight Polyamide Resin for Epoxy Coatings & Flooring
Price:
Negotiation
MOQ:
20ft container
Delivery Time:
14working days
Brand:
WeiLi Resin®
Product Description
Low-Molecular-Weight Polyamide Resin for Epoxy Coatings & Flooring
SE-5703B is a high-viscosity, low-molecular-weight polyamide resin diluted with xylene. It is used as a curing agent for epoxy resins and is widely applied in the preparation of room-temperature-curing solvent-based epoxy resin coatings, heavy-duty anti-corrosion coatings, floor paints (epoxy flooring), and adhesives. It features relatively low viscosity for easy handling. When combined with epoxy resin, the resulting coating exhibits good adhesion, excellent flexibility, long pot life, and outstanding overall performance.
Physical Properties
Performance Features
- Strong adhesion
- Good flexibility
- Room-temperature curing with long pot life
- Low toxicity
Storage Condition
- Tightly sealed, below 30℃
- The shelf life of the original package is 730 days from production date
- Once the container is opened, it is recommended to use it within a short period of time
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Company
Xiamen WangQin Chemical Technology Co., Ltd.
Location
GOLDEN BAY WEALTH CENTER, HULI HI-TECH PARK, XIAMEN, CHINA
Contact Person
Rena Xiao