BERGQUIST SIL PAD TSP 3500 High performance thermal silicon film
 
Product features/Applications:

• Used in power supply, motor control, power semiconductors, aerospace, avionics.

BERGQUIST SIL PAD TSP 3500 are supplied in:

• Sheet form and die-cut parts

• With or without pressure-sensitive adhesive

PRODUCT PARAMETERS

 

Test item	Test method	Unit	Metric value
Color	Visual	-	White
Reinforcement Carrier	-	-	Fiberglass
Technology	-	-	Silicone
Thickness	ASTM D374	MM	0.254 ~ 0.508
Hardness	ASTM D2240	Shore A	90
Tensile strength	-	°C-in2/W	0.33
Dielectric Breakdown Voltage	ASTM D149	Vac	4000
Volume Resistivity	ASTM D257	Ohm-meter	1×1011
Continuous Use Temp	-	​℃	- 60 ~ 200
Flame retardant rate	UL 94	-	V - 0
Dielectric constant	ASTM D150	1000 MHz	4.0
Teat conductivity coefficient	ASTM D5470	W/m·K	3.5

 
THERMAL PERFORMANCE vs PRESSURE
 

Pressure (psi)	10	25	50	100	200
TO-220 Thermal Performance (°C/W)	2.61	2.32	2.02	1.65	1.37
Thermal Impedance (°C-in2/W)	0.57	0..43	0.33	0.25	0.20

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PRODUCT DISPLAY

 

 

 

PACKING OF TRANSPORT

 

SHENZHEN PUFENG PACKING MATERIAL CO.,LTD (PUFENG) is an international machining manufacturer, who is devoting to the precision die-cutting machining field, designing adhesive products, insulation products, sourcing the best solutions and improving the quality and performance of products for customer.
The operation principle of PUFENG is "Running based on the market and sincerity,client and high quality come first." In order to provide a complete set of on-step products and service to customer, PUFENG has formed a strong technical team for worldwide customers to develop precision products. PUFENG’s quality principle is “Serve customers precisely on every tiny point of the demand from customer.” We hope to build up business relationships with you on the basis of equality and mutual benefit.