Bergquist 3.0 W/m·K Gap Pad 3000S30/TGP3000 Insulated Silicone Gasket

Bergquist 3.0 W/m·K Gap Pad 3000S30/TGP3000 insulated silicone gasket
 

Product overview :

• Gap Pad 3000S30 is a thermal gap filler material that provides outstanding thermal conductivity at low pressures thanks to a new high thermal conductivity filler and low modulus resin formulation.

Product features/Applications:

• Used in Processors,Server S-RAMs,Mass storage drives ,Wireline / wireless communications hardware,Notebook computers,BGA packages,Power conversion.

PRODUCT PARAMETERS

 

Test item	Test method	Unit	Meteic value
Color	Visual	-	Light blue
Reinforcement Carrier	-	-	Fiberglass
Thickness	ASTM D374	MM	0.254 ~ 3.175
Inherent Surface Tack	-	1 sided	2
Density	ASTM D792	g/cc	3.2
Heat Capacity	ASTM E1269	J/g-K	1.0
Hardness	ASTM D2240	Shore 00	30
Young's Modulus	ASTM D575	psi / kPa	26 / 180
Dielectric Breakdown Voltage	ASTM D149	Vac	＞3000
Volume Resistivity	ASTM D257	Ohm-meter	1×109
Continuous Use Temp	-	​℃	-60 ~ 200
Flame retardant rate	UL 94	-	V - 0
Dielectric constant	ASTM D150	1000 MHz	7.0
Teat conductivity coefficient	ASTM D5470	W/m·K	3.0

 

PRODUCT DISPLAY

 

 

 

PACKING OF TRANSPORT

 

SHENZHEN PUFENG PACKING MATERIAL CO.,LTD (PUFENG) is an international machining manufacturer, who is devoting to the precision die-cutting machining field, designing adhesive products, insulation products, sourcing the best solutions and improving the quality and performance of products for customer.
The operation principle of PUFENG is "Running based on the market and sincerity,client and high quality come first." In order to provide a complete set of on-step products and service to customer, PUFENG has formed a strong technical team for worldwide customers to develop precision products. PUFENG’s quality principle is “Serve customers precisely on every tiny point of the demand from customer.” We hope to build up business relationships with you on the basis of equality and mutual benefit.