TCK Series Thermal Profiler with 80,000 Data Points per Channel, 0.1℃ Resolution, and RF Transceiver for Reflow Oven Monitoring
Price:
Negotiable
MOQ:
1 set
Delivery Time:
7~9 work days
Brand:
HSTECH
Product Description
TCK Series Thermal Profiler Overview
Professional thermal profiling instrument for reflow oven and wave soldering process monitoring with high-precision temperature measurement capabilities.
Package Contents
| Primary Components | Additional Accessories |
|---|---|
| Thermal profiler | Data download line |
| Insulation box | Hi-temp adhesive tape |
| Temperature test line | "+" screwdriver |
| Charger | Tweezers |
| Software CD | Insulated gloves |
| Solder wire | Scissors |
| Instrument box | User Manual |
| Acceptance Certificate | RF Transceiver (Optional) |
| Wave Test System (Optional) |
Key Features & Benefits
High-Quality PLC Components
Ensures exceptional stability and reliability during thermal profiling operations.
Factory New Condition
Unopened original equipment guaranteeing optimal performance and longevity.
Global Availability
Showroom access in United States, France, and Germany for convenient inspection.
Certified Performance
Comprehensive machinery test reports ensure compliance with international standards.
Technical Specifications
- Thermocouple Type: K-type thermocouple
- Sampling Interval: 0.05-600 seconds (software configurable)
- Data Capacity: 80,000 data points per channel, 20 profile sets
- Resolution: 0.1℃
- Temperature Range: 0-1000℃
- Measurement Accuracy: ±1.0℃
- Power Consumption: ≤120mW
- Operating Voltage: 3.6VDC rechargeable battery
- Dimensions: 195×82×21mm / 195×103×21mm
- Insulation Box: 245×100×30mm
- Start Modes: Manual, specified time, or specified temperature
- Record Modes: Monitor/Record
- Connection Options: USB/RF wireless
- Software: ProfileManager 2.0
Software Management Modules
Comprehensive software suite for complete thermal process management:
- Product Library Manager
- Machine Library Manager
- Solder Library Manager
- Recipe Library Manager
Data Analysis Parameters
Process Window Index (PWI) analysis includes:
- Peak Temperature measurement
- Times exceeding temperature limits
- Time duration within reflow temperature range
- Temperature slope during reflow process
- Time slope during wave soldering
Product Documentation
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hansome Technology Co., Ltd.
Location
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person
Rudi Jin